LED board interconnect schemes for illuminable assemblies are provided. Multiple LED boards may form a partial perimeter along an illuminable assembly. The multiple LED boards and interconnects must fit within a limited width and height of the illuminable assembly. In some implementations, an interconnect board and spring connectors are used to provide a low-profile electrical interconnection while maintaining co-planarity of the LEDs across the LED boards.

Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

A downhole system including a gun string configured to be deployed into a wellbore, the gun string including plural gun assemblies. A detonator block attached to a given gun assembly of the plural gun assemblies. The detonator block includes a switch assembly. The switch assembly includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator associated with the detonator block, a measuring unit configured to measure a parameter (V) at the switch assembly, and a computing core (CC) configured to locally make a decision whether to activate or not the detonator, after the fire command is received from the external controller, based on whether a voltage measured by the measuring unit at the switch assembly is larger or not than a threshold voltage.

A circuit board with a connector connection for the direct contacting with a connector, wherein the connector connection is formed on the front side of the circuit board with a contact pin that is arranged centrally in a blind hole while forming a circular ring-shaped cylindrical insertion space and that has an inner hole with a first contact zone of an inner conductor for contacting an inner conductor of the connector. A second contact zone of an outer conductor is arranged in the insertion space for contacting an outer conductor of the connector.

A connection structure-embedded substrate includes: a printed circuit board including a plurality of first insulating layers of which at least one has a cavity provided therein, a plurality of first wiring layers disposed as at least one of an outer portion and an inner portion of the plurality of first insulating layers, and a first build-up insulating layer disposed on an upper surface of the plurality of first insulating layers; and a connection structure at least partially disposed in the cavity. The first build-up insulating layer is disposed in the cavity, and each of a lower surface of the connection structure and a lower surface of the cavity is in contact with at least a portion of the first build-up insulating layer, respectively.

An aerosol generator includes a container and an atomizing module arranged in the container. The container has a liquid chamber and an aerosol chamber respectively arranged at two opposite sides of the atomizing module. The atomizing module includes an annular vibration plate, a microporous member, and a circuit board. The vibration plate has a first hole, and the microporous member is disposed on the vibration plate and covers the first hole. The circuit board is electrically coupled to an electrical contact of the vibration plate. The circuit board is arranged at one side of at least part of the vibration plate, and the circuit board and the at least part of the vibration plate have a gap there-between. A projected region defined by orthogonally projecting the circuit board onto a plane overlapping with the electrical contact partially covers the least part of the vibration plate.

A semiconductor assembly is described that includes a substrate having top and bottom sides. An integrated circuit die coupled to the substrate includes first and second distinct sets of ground pads. In some embodiments, the first and second sets of ground pads are configured to have distinct ground return paths to a host system. In further embodiments, one of the ground return paths may include a metal plate coupled between ground contacts on the top side of the substrate and ground contacts on a printed circuit board of the host system.

This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15° . Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.

A conductive member for a touch panel includes a transparent insulating member; and a plurality of first electrodes extending in a first direction and arranged in parallel in a second direction intersecting the first direction, in which the plurality of first electrodes are constituted by a first mesh conductive film a plurality of fine metal wires are electrically connected, the plurality of first electrodes include a plurality of first main electrodes each having an electrode width Wa defined in the second direction and at least one first sub-electrode having an electrode width Wb smaller than Wa of the first main electrode in the second direction, the first sub-electrode is the first electrode arranged on an outermost side among the plurality of first electrodes, an opening ratio of the first sub-electrode is smaller than that of the first main electrode, and the first main electrode has a first dummy pattern.

A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator, a voltage measuring unit configured to locally measure a voltage (V) at the switch assembly after receiving the fire command to activate the detonator, a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator and after measuring the voltage (V), based on whether or not the measured voltage (V) at the switch assembly is larger than a threshold value.