A packaging method includes steps of: forming first and second wiring layers electrically connected to each other on two opposite surfaces of a substrate; then configuring mother substrate interconnecting bumps on the first wiring layer and along perimeter of a daughter substrate unit, and then cutting along the perimeter of the daughter substrate unit to expose lateral faces of the mother substrate interconnecting bumps and configuring solder materials thereon; then configuring first and second chips on the first and the second wiring layers to form electrical interconnection between the two chips. A package structure enables interconnecting two chips through one single daughter substrate unit with its wiring layers directly connecting with lateral face contacts of the mother carrier substrate through the mother substrate interconnecting bumps. Hence, area of the daughter substrate unit is reduced; lengths of the interconnection paths are shortened, and qualities of communication and space utilization are enhanced.

A circuit board includes: a first surface and a second surface opposite to the first surface; a through hole extending between the first surface and the second surface; a conductor covering an inner wall surface of the through hole, a first end and a second end of the conductor being terminated inside the through hole; and a wire connected to the conductor, wherein a sum of a length from a contact portion where the conductor contacts a connector pin inserted in the through hole to the first end of the conductor, and a length from a wire connecting portion where the conductor is connected to the wire to the second end of the conductor is 0.5 mm or less.

A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.

Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.

A connecting structure for printed circuit boards has two printed circuit boards. At least one of the two printed circuit boards is a flexible printed circuit board, and each one of the two printed circuit boards has at least one connecting portion. The at least one connecting portion protrudes from an end of the printed circuit board, and is soldered on a top surface of the other printed circuit board. Each of the printed circuit boards is attached to the other printed circuit board only by a part (connecting portion), such that the solders on the connecting portion can extend forward and in two transverse directions beyond the connecting portion, thereby increasing the contact area between the solder and the top surface of the other printed circuit board. Therefore, the connecting structure can firmly connect two printed circuit boards and can enhance the resistance to pull.

A method of fabricating a packaging substrate having an embedded through-via interposer is provided. The method includes providing a through-via interposer having opposite first and second sides and conductive through-vias in communication with the first and second sides, wherein each of the conductive through-vias has a first end surface on the first side and a second end surface on the second side, and the second end surfaces protrude below the second side to serve as conductive bumps. Next, forming a redistribution layer on the first side and the first end surfaces such that the redistribution layer electrically connects with the first end surfaces. Afterwards, forming an encapsulant layer to encapsulate and embed the through-via interposer, wherein the encapsulant layer has opposite first and second surfaces. Next, forming a built-up structure on the second surface of the encapsulant layer, the second side of the through-via interposer and the conductive bumps.

A board-to-board connection structure includes a first circuit board, a second circuit board, and a connector. The first circuit board includes a first base layer and a first outer circuit layer. The second circuit board includes a second base layer and a second outer circuit layer. The connector electrically couples the first circuit board and the second circuit board. The connector includes a housing, a first electrical connection portion, and a second electrical connection portion. A side surface of the first circuit board includes a first conductive layer electrically coupled to the first outer circuit layer. The connector is coupled to the first conductive layer through the first electrical connection portion. The second circuit board is located in the housing, and the second electrical connection portion is electrically coupled to the second outer circuit layer.

A housing has a first positioning hole that penetrates the housing in the vertical direction. A suction cap includes a suction plate part to be sucked by a suction nozzle, and a plurality of positioning protrusion parts, each of which is to be inserted into a first positioning hole of the housing of an input/output board-side connector and a CPU board-side connector in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector. Each positioning protrusion part is inserted into each corresponding first positioning hole in the state where the suction cap holds the input/output board-side connector and the CPU board-side connector, which achieves the positioning of the input/output board-side connector and the CPU board-side connector with respect to the suction cap.

A connector for a display device is capable of visually detecting defects when an FPCB is connected to a PCB in the display device, e.g., a tablet and a smart phone. The connector includes a first gaff-type connection portion disposed at one end portion of a flexible printed circuit board, and a second gaff-type connection portion disposed at one end portion of a printed circuit board and fitted to the first gaff-type connection portion.

A display device is basically provided that comprises a display, two circuit boards, and a cable. The cable connects the circuit boards together and includes a sheet-form wiring component having a first face and a second face on the opposite side from the first face, a first insulating part that is disposed on the first face, and a shield component that is disposed on the first insulating part and shields electromagnetic waves. The cable has a bent part that is bent to a second face side. The angle α formed by a direction towards one end of the wiring component from the bent part and a direction towards the other end of the wiring component from the bent part is 0°<α<180°.