A printed board assembly (PBA) is provided. The PBA includes first printed circuit board (PCB), a second PCB disposed parallel to the first PCB and including a conductive area, a first interposer surrounding a space between the first PCB and the second PCB, and a wireless communication circuit, wherein the interposer may include a first partition wall structure configured to provide shielding for at least one electronic component disposed in the PBA, and a second partition wall structure connected to the first partition wall structure and including an dielectric material, the second partition wall structure including a conductive via configured to connect the first PCB and the second PCB, and the wireless communication circuit may transmit and/or receive a signal in a specified frequency band by feeding power to the conductive area of the second PCB through the conductive via.

A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern.

Provided is an electric power converter, including: a casing; a heat radiating plate having a first main surface and a second main surface; and a substrate which is fixed to the main surface and to which a heat generating component is mounted, wherein the casing has an inner wall surface in which a first tapered portion is formed, wherein the heat radiating plate includes a second tapered portion which is connected to the first tapered portion in a heat exchangeable manner and slid with respect to the first tapered portion, wherein the heat radiating plate is configured to be displaced in a first direction with respect to the casing by the second tapered portion being slid with respect to the first tapered portion, and wherein the heat generating component is connected to the casing in a heat exchangeable manner by the heat radiating plate being displaced in the first direction.

Electronic device fastening systems that enable one or more electronic devices to be reliably and quickly secured on a host board and electronic systems made of the same. In a specific exemplary embodiment, a retainer clip spans across the width of one or more electronic devices, engages with the board and snaps into place. The clip includes one or retaining posts such that when the clip engages the board, the one or more retaining posts align and engage with a predefined mounting feature of a corresponding one of the one or more electronic devices, thereby securing the electronic device in place to restrict horizontal, lateral, and vertical movement of the electronic device.

An apparatus comprises a transceiver (Tx/Rx) printed circuit board (PCB) with a top surface and a bottom surface and a power supply PCB. The Tx/Rx PCB includes two transmitter devices, each comprising a number N of channels. A first transmitter device is arranged on the bottom surface and a second transmitter device is arranged on the top surface over the first transmitter device. One or more pins of the second transmitter device are shorted with one or more pins of the first transmitter device with the same function. An analog front end (AFE) device comprising N input channels is arranged on the top surface of the Tx/Rx PCB, and a digital signal processor is coupled to the AFE device. The power supply PCB comprises a power supply module configured to provide a plurality of supply voltages to the Tx/Rx PCB and the power supply PCB.

A laser ignition assembly comprises first and second mounting surfaces opposed to each other. A central cavity is formed through the surfaces and sized to receive energetic material therein. A vertical solder bridge is formed between the surfaces and an edge emitting laser diode disposed between the surfaces. The laser diode is oriented such that a light fluence therefrom is directed in a radial direction into the central cavity. The surfaces can be circuit boards, e.g., copper clad, rigid circuit boards, and have an annular shape. The central cavity can be further defined by an interboard gap between the surfaces. The ignition assembly can fit within a primer cup of a munition.

An RFID tag includes an RFID IC, flexible substrates including first wiring conductors and rigid substrates including second wiring conductors. Substrate surfaces of the flexible substrates include first regions connected to the rigid substrates and second regions that include opposite surfaces and are not connected to the rigid substrates. First conductor portions and second conductor portions included in the first wiring conductors are electrically connected to each other via the second wiring conductors. The RFID IC is connected to the first wiring conductors, the second wiring conductors, or both the first wiring conductors and the second wiring conductors.

A high voltage power supply can be compact with shielded electronic components. The power supply can include multiple stages separated by circuit boards. Electronic components for each stage can be directly soldered to adjacent circuit boards. Traces can pass through and electrically couple electronic components on each side of the circuit board between them.

A solid-state drive (SSD) includes a first rigid printed circuit board comprising a surface that defines a first plane. A second rigid printed circuit board of the SSD comprises a surface that defines a second plane that is substantially parallel to the first plane. A flexible interconnect couples the first rigid printed circuit board and the second rigid printed circuit board. The flexible interconnect partially encloses a volume. A capacitor is disposed within the volume.

A solution is provided that can be used in a communication node. A case is provided that supports a card module. The card module includes a circuit board with a front edge and a rear edge and includes a chiclet mounted adjacent the front edge. A housing can be pressed onto the circuit board and chiclet and be retain the housing in place. A transformer box is provided is provided on the circuit board between the housing and the rear edge. A POE card can be mounted on the circuit board between the transformer box and the housing.