Provided is an electronic control unit capable of suppressing an increase in size of a board. An electronic control unit of the present invention includes a connector having a power supply terminal, a power supply board 12 (first board), and a control board 13 (second board). The power supply board includes an inner-layer copper foil 55 (inner-layer conductor), and a power conversion circuit that converts input power input via a power supply terminal into predetermined output power is mounted thereon. The control board 13 includes an inner-layer copper foil 55, and mounted with a control circuit is mounted thereon. In addition, a thickness of the inner-layer copper foil 55 of the power supply board 12 is thicker than a thickness of the inner-layer copper foil 55 of the control board 13.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.

A video transcoding card includes a first transcoding assembly and a second transcoding assembly. The first transcoding assembly includes a first circuit board, first transcoding boards, and a first main electrical connector. The first transcoding boards and the first main electrical connector are disposed on the first circuit board and are electrically connected to the first circuit board. The second transcoding assembly includes a second circuit board, second transcoding boards and a second main electrical connector. The second transcoding boards and the second main electrical connector are disposed on the second circuit board and are electrically connected to the second circuit board. The first main electrical connector and the second main electrical connector are connected to each other, and the second transcoding boards are electrically connected to the first circuit board via the second circuit board, the second main electrical connector, and the first main electrical connector.

A flexible circuit board includes a first substrate, display panel signal traces, a touch chip, at least one second substrate, a touch auxiliary device, first touch signal traces and at least one second touch signal trace. The display panel signal traces, the touch chip and the at least one second substrate are located on the same side of the first substrate; and the touch auxiliary device is located on a second substrate. The first touch signal trace includes a first connection trace and a first transfer trace that are electrically connected to each other. The second touch signal trace includes a second connection trace and a second transfer trace that are electrically connected to each other. The first connection trace and the second connection trace are disposed on the first substrate, and the first transfer trace and the second transfer trace are disposed on the at least one second substrate.

According to an embodiment of the disclosure, a wearable electronic device may include a housing, a first printed circuit board (PCB), a second PCB disposed in parallel with the first PCB, a first interposer, and a second interposer, and the housing may include at least one first opening formed on a first portion, and the first interposer and the second interposer may be disposed between the first PCB and the second PCB, the first interposer and the second interposer may be disposed to have a first end of the first interposer and a second end of the second interposer facing the first end, spaced apart by a designated distance, and a first space between the first end and the second end may be connected to the at least one first opening of the housing. Various other embodiments are possible.

A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.

A circuit board assembly and electronic device are provided that improve the reliability of the connection between circuit boards and electronic components. The circuit board assembly includes a first circuit board, including a first side surface and a first sidewall pad, where the first sidewall pad is disposed on the first side surface, a second circuit board, fastened to the first circuit board, where the first sidewall pad is located at a position close to the second circuit board, and sidewall solder, adhered to the first sidewall pad and the second circuit board.

A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.

Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.

An inverter apparatus includes a main circuit substrate, an EMC filter substrate, a control substrate, and a panel. The main circuit substrate is configured to convert electric power and includes an output terminal through which the electric power is output from the inverter apparatus. The EMC filter substrate is provided on the main circuit substrate and configured to reduce propagation of electromagnetic noise. The EMC filter substrate includes a first input terminal through which the electric power is input to the inverter apparatus. The control substrate is provided on the EMC filter substrate so that the EMC filter substrate is sandwiched between the main circuit substrate and the control substrate. The control substrate is configured to control the main circuit substrate. The panel is provided on the control substrate so that the control substrate is sandwiched between the EMC filter substrate and the panel.