Patent classifications
H05K1/147
INTERCONNECT, AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY
An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.
ELECTRONIC DEVICE
An electronic device includes a middle frame, a first flexible printed circuit FPC, a second FPC and a battery. Projections of the first FPC and the second FPC on the middle frame have a first overlapping region. The first overlapping region is located inside a projection of the battery on the middle frame and is far away from an edge of the battery. A first through hole is disposed on the middle frame. The first overlapping region is located in the first through hole. The electronic device provided in this application can implement reduction of an overall thickness, so that the electronic device provides better user experience.
Optoelectronic Apparatus and Optoelectronic Integration Method
An optoelectronic apparatus (200) and an optoelectronic integration method are disclosed, so that bandwidth for signal transmission can be improved, and signal transmission performance is improved. The optoelectronic apparatus (200) includes: a printed circuit board PCB (201), where a first substrate (203) and a second substrate (205) are separately disposed on the PCB (201), an application specific integrated circuit ASIC (202) is disposed on the first substrate (203), and an optoelectronic component (204) is disposed on the second substrate (205); and a flexible printed circuit FPC (206), where a first end of the FPC (206) is disposed on an upper surface of the first substrate (203) and is electrically connected to the ASIC (202), and a second end of the FPC (206) is disposed on the second substrate (205) and is electrically connected to the optoelectronic component (204).
ELECTRONIC DEVICE INCLUDING DISPLAY MODULE HAVING MULTIPLE FPCBS
An electronic device is provided. The electronic device includes a frame, a first partition wall protruding from the frame in a first direction and dividing the frame into a first area and a second area, a second partition wall portion protruding from the frame in the first direction and dividing the frame into a second area and a third area, a first printed circuit board disposed in the first area, a battery disposed in the second area, a second printed circuit board disposed in the third area, and a display circuit including at least two flexible printed circuit boards. The flexible printed circuit boards include an overlapping area in which at least some areas overlap, the overlapping area being disposed in the second area, and, in the frame, an opening is formed in a portion facing the overlapping area.
DISPLAY DEVICE
A display device includes a display panel, a support member disposed under the display panel, a circuit board electrically connected to the display panel and disposed under the support member, and a metal sheet disposed between the circuit board and the support member, bonded to the circuit board by a first adhesive film, and bonded to the support member by a second adhesive film.
Object provided with an electro-optic display device
An object includes an electro-optic display device provided with an optically active element, the optical properties thereof can be modified by applying an electric voltage or current between at least one electrode and one corresponding auxiliary electrode, between which the optically active element is disposed. The object further includes a middle part which delimits an opening closed by a crystal including a bottom surface beneath which the electro-optic display device is arranged. The crystal is provided with an opaque frame which is made remotely from the edges of the opening and which covers the contour of the electro-optic display device so as to conceal electrical connection elements. The electro-optic display device defines an active display area which is confined by the opaque frame, such that, when the electro-optic display device is activated and displaying information, a transparent area remains between the opaque frame and the edges of the opening.
Electronic device
An electronic device is disclosed, which includes: a support unit; a display panel disposed on the support unit; a first circuit board, wherein the support unit is disposed between the display panel and the first circuit board; an electronic component disposed on the first circuit board; and a second circuit board electrically connected to the display panel, wherein the second circuit board includes a first portion and a second portion, and the support unit is disposed between the first portion and a second portion, wherein the first circuit board is electrically connected to the display panel through the second circuit board.
PRINTED CIRCUIT BOARD COMPRISING GROUND WIRE
A printed circuit board includes: a first layer including a first ground including a first opening, wherein a first ground wire is within the first opening; a second layer disposed in a direction from the first layer and including a second ground including a second opening, wherein the second opening at least partially overlaps with the first opening and wherein a second ground wire is within the second opening; a third layer between the first layer and the second layer and including a third opening, wherein the third opening at least partially overlaps with the first opening and wherein a first via pad is within the third opening; and a fourth layer between the second layer and the third layer and including a fourth opening, wherein the fourth opening at least partially overlaps with the third opening and wherein a second via pad is within the fourth opening.
Foldable electronic device including flexible printed circuit board
According to an embodiment, it is possible to provide an electronic device including: a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing and spaced apart from the first printed circuit board; a first flexible printed circuit board electrically connecting the first printed circuit board and the second printed circuit board; and a second flexible printed circuit board electrically connecting the first printed circuit board and the second printed circuit board, in which the second flexible printed circuit board may be longer than the first flexible printed circuit board. Other embodiments are also disclosed.
Chip on flex, touch assembly, and display device
The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.