A battery pack comprises a set of battery cells, a battery cell holder holding the battery cells, at least one battery strap having a first end connected to a terminal of one of the battery cells and a second end extending from the battery cell holder, a printed circuit board having a first side and a second side, components mounted on the second side of the printed circuit board, a trace on the second side of the printed circuit board extending from one components to a contact connected to the trace and mated with the second end of the at least one battery strap. Multiple vias extend from the first side to the second side, and the contact comprises a first portion having a through hole and a leg integrally formed with and approximately perpendicular to the first portion, the leg extending from the first side of the PCB to the second side of the PCB through a first via, the trace extending from the first via, the leg soldered to the second side of the PCB and the via and the through hole aligned with a second via adjacent to the first via, the through hole sized and configured to receive a PCB end of the strap, the PCB end of the strap soldered to the contact.

A capacitor and an electronic device comprising same are disclosed. An electronic device according to the present disclosure may comprise: a substrate; a plurality of capacitors mounted on the substrate, each of the plurality of capacitors including a case extending to accommodate an electrolyte therein, and a cap coupled to one end of the case in the direction in which the case extends configured to restrict scattering of the electrolyte; and a fixing member comprising a protrusion and configured to press the perimeters of the caps in the radial direction of the caps to fix the plurality of capacitors to the substrate.

A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.

Embodiments are directed to a method of embedding a discrete component in a substrate. The method includes forming a cavity in the substrate. The method further includes inserting a discrete component into the cavity, wherein the discrete component comprises a top terminal and a bottom terminal. The method further includes positioning the discrete component within the cavity such that the top terminal is above the bottom terminal and below a front face of the substrate. The method further includes forming an intermediate conductive material within the cavity and over the top terminal. The method further includes forming a top conductive material over the intermediate conductive material such that the top conductive material is electrically coupled through the intermediate conductive material to the top terminal.

A wiring substrate includes: an insulating substrate including a base portion comprising a through hole having a first opening and a second opening, and a frame portion located on the base portion; and a heat dissipator disposed on a side of the base portion that is opposite to the frame portion so as to block the second opening, wherein an inner surface of the through hole faces a side surface of the heat dissipator with a clearance being provided between the inner surface of the through hole and the side surface of the heat dissipator.

An electronic device including a substrate comprising a hole, and a capacitor capable of being inserted and fixed to the hole of the substrate. The electronic device includes a substrate including a hole, and a capacitor inserted to the hole so as to be mounted on the substrate. The capacitor includes a case provided to accommodate a dielectric therein and forming an exterior of the capacitor, a lead wire connected to the dielectric and extending from an inside of the case to an outside of a first side surface of the case, and a groove recessed on a second side surface of the case opposite to the first side surface and provided to be engaged with a side, which forms a circumference of the hole, of the substrate to allow the case to be inserted and fixed to the hole.

In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

A receptacle connector includes a housing defining a base and a mating tongue forwardly extending therefrom, a first row of contacts disposed in the housing with contacting sections and surface mount type tail sections for mounting on a PCB, a second row of contacts disposed in the housing with contacting sections and through hole type tail sections for mounting in the PCB; a metallic shield including a capsular segment surrounding the mating tongue to define a mating cavity and a rear wall covering a rear face of the base to surrounding the surface mount type tail sections and a lower bracket attached to the metallic shielding. The lower bracket is located upon a bottom side of the shield and includes a bottom wall, two sidewalls and a rear wall commonly surrounding the through hole type tail sections.

A printed circuit board (PCB) assembly is provided. The PCB assembly comprises a printed wiring board (PWB) and one or more electrical components mounted thereon. The PWB comprises a plurality of layers including conductive layers and insulative layers, where one or more of the insulative layers is a prepreg layer that is halogen-free; one or more slotted portions on a surface of the PWB, which are indented into the PWB; and one or more pads disposed on the surface of the PWB, which are paired with the one or more slotted portions. Each of the one or more electrical components is mounted on the surface of the PWB through a pair of a slotted portion and a pad.

Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.