A method for printed cable installation in a harness system of an aircraft. The method includes: printing at least a first conductive trace comprising conductive particles to a surface of an aircraft with a printing technology; printing at least second conductive trace comprising conductive particles to the surface of an aircraft with the printing technology; sintering the first and the second conductive traces by a laser, and interposing an insulating film between the first and the second conductive traces. For a trace length less than 5 meters, the first and second conductive traces provide the electromagnetic compatibility of a twisted pair of wires when printed with a guard trace.

A method for manufacturing a flexible printed circuit board includes preliminarily thermally deforming s substrate through heating, forming a circuit pattern with a conductive paste on the preliminarily thermally deformed substrate, and firing the circuit pattern. A flexible printed circuit board includes a substrate, and a circuit pattern formed by firing a conductive paste on a first surface of the substrate. The substrate is preliminarily thermally deformed and, thus, a shrinkage variation thereof before and after firing the conductive paste is zero. Dimensional stability when firing the circuit pattern printed with the conductive paste can be ensured, deterioration of adhesion between the circuit pattern and the substrate attributable to film deformation upon firing can be prevented, and stable adhesion of the circuit pattern can be maintained even after firing.

The present disclosure relates to electronic devices and methods of manufacturing electronic devices. A method of manufacturing a dissolvable electronic device includes forming a dissolvable sheet; applying a self-sintering agent to the dissolvable sheet to form a substrate; and depositing electrically conductive ink onto the substrate in a trace. A method of manufacturing a meltable electronic device includes mixing a conductive material with a melted wax to form a conductive wax mixture in liquid form; molding the conductive wax mixture; and solidifying the conductive wax mixture to obtain the meltable electronic device. A method of manufacturing an edible electronic device includes cutting a layer of conductive material to form a pattern that defines a circuit; applying the layer of conductive material to an edible medium, wherein the edible medium is in liquid or semi-solid form; and solidifying the edible medium to obtain the edible electronic device.

A method for printing a micro line pattern using inkjet printing, includes: a bump forming process for forming a micro bump that sections a predetermined conductive pattern by inkjet-printing a quick drying liquid on a substrate; and a pattern printing process for printing a conductive pattern according to the predetermined conductive pattern by inkjet-printing a conductive liquid on an area sectioned by the micro bump.

A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m.sup.2.

An embodiment of a method includes depositing a quantity of first intermediary material onto an electrically insulating substrate in a pattern corresponding to a desired pattern of a first conductive structure. The first intermediary material is adhered to the substrate to form a first intermediate layer to maintain the desired pattern of the first conductive structure. A quantity of a precursor of electrically conductive material is deposited generally along the pattern of the first intermediate layer. Energy is applied to enable migration and consolidation of the first electrically conductive material along the pattern of the first intermediate layer, forming a functional, electrically conductive top layer. At least one of the first electrically conductive material and its precursor has a wetting angle of less than 90 relative to the first intermediate layer, and a wetting angle greater than 90 relative to the substrate. At least one of the depositing steps is an additive deposition step.

The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.

A one-step react-on-demand (RoD) method for fabricating flexible circuits with ultra-low sheet resistance, enhanced safety and durability. With the special functionalized substrate, a real-time three-dimensional synthesize of silver plates in micro scale was triggered on-demand right beneath the tip in the water-swelled PVA coating, forming a three-dimensional metal-polymer (3DMP) hybrid structure of 7 m with one single stroke. The as-fabricated silver traces show an enhanced durability and ultralow sheet resistance down to 4 m/sq which is by far the lowest sheet resistance reported in literatures achieved by direct writing. Meanwhile, PVA seal small particles inside the film, adding additional safety to this technology. Since neither nanomaterials nor a harsh fabrication environment are required, the proposed method remains low-cost, user friendly and accessible to end-users. the RoD approach can be extended to various printing systems, offering a particle-free, sintering-free solution for high resolution, high speed production of flexible electronics.

A printed electrical device is formed using a flexographic printing system. A flexographic printing plate having a pattern of raised features includes an active region having a plurality of parallel traces separated by a trace spacing of between 5-40 microns that are used to form active micro-traces that provide an electrical function, and an inactive region adjacent to the active region having one or more protective features that are used to form electrically-inactive features. The protective features are separated from an outermost trace of the plurality of traces by a gap distance of between 60% and 250% of the trace spacing. The flexographic printing plate is used to transfer ink from an anilox roller to a substrate to provide a printed pattern corresponding to the pattern of raised features on the flexographic printing plate.

A process for depositing metal or metal alloy on a substrate including treating the substrate surface with an activation solution comprising a source of metal ions so the metal ions are adsorbed on the substrate surface, treating the obtained substrate surface with a treatment solution containing an additive selected from thiols, thioethers, disulphides and sulphur containing heterocycles, and a reducing agent suitable to reduce the metal ions adsorbed on the substrate surface selected from boron based reducing agents, hypophosphite ions, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, sources of formaldehyde, glyoxylic acid, sources of glyoxylic acid, glycolic acid, formic acid, sugars, and salts of aforementioned acids; and subsequently treating the substrate surface with a metallizing solution comprising a source of metal ions to be deposited such that a metal or metal alloy is deposited thereon.