A method for manufacturing a circuit board is provided, including providing a substrate. A first inkjet printing step is performed to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction. The microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction. Also, a second inkjet printing step is performed to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.

Provided is a novel printing process for fabricating metallic, conductive and transparent ultra-thin nanowires and patterns including same on a substrate. The process includes two different controllable steps, each designed to achieving a useful and efficient pattern.

A coating pattern formation method includes adjusting lyophilicity of a pattern region provided on a substrate, and forming a coating pattern having a shape of the pattern region by applying a coating liquid to the pattern region after the adjusting of the lyophilicity of the pattern region. The lyophilicity of the pattern region is adjusted such that the pattern region is divided into a plurality of small pattern regions in at least one division direction, such that adjacent small pattern regions have different lyophilicity, such that a small pattern region spaced away from an end of the pattern region has the lowest lyophilicity among the small pattern regions in the at least one division direction, and such that the lyophilicity of the small pattern regions increases from the small pattern region having the lowest lyophilicity toward the end of the pattern region.

The disclosure generally relates to a method of creating patterned metallic circuits (e.g., silver circuits) on a substrate (e.g., a ceramic substrate). A porous metal interlayer (e.g., porous nickel) is applied to the substrate to improve wetting and adhesion of the patterned metal circuit material to the substrate. The substrate is heated to a temperature sufficient to melt the patterned metal circuit material but not the porous metal interlayer. Spreading of molten metal circuit material on the substrate is controlled by the porous metal interlayer, which can itself be patterned, such as having a defined circuit pattern. Thick-film silver or other metal circuits can be custom designed in complicated shapes for high temperature/high power applications. The materials designated for the circuit design allows for a low-cost method of generating silver circuits other metal circuits on a ceramic substrate.

Provided is a manufacturing method of an electronic device, the method including: a step of preparing an electronic substrate including a wiring board, an electronic component disposed on the wiring board, and a ground electrode having an organic acid on a surface thereof; and a step of applying an ink for forming a conductive layer onto at least a part of the ground electrode having the organic acid on the surface thereof, to form a conductive layer that is a cured film of the ink for forming a conductive layer, in which the organic acid includes at least one compound selected from the group consisting of a monocarboxylic acid having a molecular weight of less than 350 and a dicarboxylic acid having a molecular weight of less than 350.

A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m.sup.2.

An aliphatic polycarbonate resin for forming a partition containing a constituent unit represented by the formula (1):

##STR00001##

wherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are each independently a hydrogen atom, an alkyl group having one or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; at least one of R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is an alkyl group having two or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; and R.sup.1, R.sup.2, R.sup.3, and R.sup.4 may be the same or different; and the aliphatic polycarbonate resin has a contact angle against water of 75 or more. Also disclosed is a partition material including the aliphatic polycarbonate resin, a substrate, a method of producing the substrate, a method for producing a wiring substrate, and a wiring forming method.

A laminate that includes a metal layer that is not easily separated from a substrate, a method for producing the laminate, and a method for forming a fine conductive pattern that exhibits high conductivity, are disclosed. The peel strength of a metal layer included in a laminate that includes a polymer layer provided between a substrate and the metal layer is improved by implementing a structure in which the metal that forms the metal layer is chemically bonded to COO that extends from the polymer main chain that forms the polymer layer at the interface between the metal layer and the polymer layer. A fine conductive pattern that exhibits high conductivity can be formed by applying UV light to a pattern area of an insulating film formed on a substrate, and applying an ink prepared by dispersing metal nanoparticles in a solvent to the substrate to effect adhesion and aggregation of the ink in the pattern area, the surface of the metal nanoparticles being protected by an organic molecule layer.

A method and a system for generating spray patterns, an electronic device, and a storage medium. The method includes: step 1: obtaining a first opening shape; step 2: obtaining a preset spray printing dot; step 3: obtaining a qualification ratio T according to a ratio of a total solder-paste weight Q corresponding to a total length of spray-printing line segments to a solder-paste weight Q.sub.1 required for the first opening shape or a ratio of the total length of all the spray-printing line segments to a line length LA, wherein the spray-printing line segments are line segments finally within the first opening shape, and the qualification ratio is a weight ratio or a length ratio; and step 4: determining a relationship among the qualification ratio T, a preset maximum qualification ratio T.sub.max, and a preset minimum qualification ratio T.sub.min to obtain the first spray pattern.

A printed circuit board according to an embodiment of the present invention includes a base film containing, as a main component, a polyimide and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film. An external transmittance for a wavelength of 500 nm in a conductive pattern non-formed region of the base film is 70% or less of an internal transmittance for a wavelength of 500 nm in a middle layer portion of the base film.