A manufacturing method for a multilayer wiring board includes: forming a groove on a surface of a first thermoplastic resin board; forming a modified layer made of resin having a melting point lower than a melting point of resin constituting the first thermoplastic resin board, by applying light to a region of the surface of the first thermoplastic resin board other than a region around the groove; filling the groove of the first thermoplastic resin board with conductive material having fluidity; and bonding a second thermoplastic resin board to the surface of the first thermoplastic resin board, on which the modified layer is formed, by thermocompression bonding.

A fabrication method of a circuit includes drilling holes in a substrate, so as to form a plurality of first opening holes and second opening holes in the substrate. A cover film is attached onto the substrate, so as to cover the first opening holes and the second opening holes. A portion of the cover film covering the first opening holes is removed, so as to expose the first opening holes. The first opening holes are filled.

Provided is a component mount board having such a structure that a state of a component mount board being soaked in liquid can be more reliably sensed. A component mount board 100 includes a sheet-shaped moisture detection sensor 90. The moisture detection sensor 90 includes: a board 10 having a base 11, a first conductive pattern 30 formed on the base 11, and a mount component 50 electrically connected to the first conductive pattern 30; and a second conductive pattern 40 forming a circuit 60 together with the first conductive pattern 30 in a complementary manner. A portion of the base 11 corresponding to the second conductive pattern 40 is a missing portion 12. The component mount board 100 further includes a water-absorption expansion material 70. When expanding by water absorption, the water-absorption expansion material 70 presses the base 11 or the second conductive pattern 40 in a direction perpendicular to the plane of the base 11 to break the second conductive pattern 40.

Disclosed is a method for printing a silver nanowire harness network structure by using a glue dispenser, including the following: 1) constructing an induced PET substrate: modifying a PET substrate by a surface hydrophobic treatment method to enhance the binding force between nanowires and the PET substrate and enhance the conductivity of a nanowire network structure; 2) constructing a glue dispensing printing system and printing the nanowire harness network structure: fixing the glue dispenser to a worktable, fixing a printed PET substrate to a ufab three-dimensional moving platform for controlling the movement of the PET substrate, adjusting the moving speed of the ufab three-dimensional moving platform and the distance between a needle head and the PET substrate, controlling the glue dispensing air pressure and the glue dispensing amount of silver nanowire glue by the glue dispenser, and obtaining the nanowire harness network structure on the PET substrate.

Disclosed is a fabrication method for electronic products, comprising planarization coating of a flexible substrate using a radiation curable composition.

A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern.

A miniature technological structure is fabricated by printing a conductive ink in a highly precise pattern onto a substrate. In one embodiment, high-resolution printing of the conductive ink is achieved by precisely patterning a hydrophobic, ink-repellant layer onto a print-receptive surface on the substrate. A water-based, conductive ink is then broadly applied to the substrate, with the ink adhering to the exposed print-receptive surfaces on the substrate and repelling from the ink-repellant layer. In this manner, the ink-repellant layer functions as mask which defines the pattern of the conductive ink retained on the substrate. Because the hydrophobic, ink-repellant layer can be printed with relatively great precision, nanoscale structures can be achieved. In lieu of applying a separate hydrophobic layer onto the substrate, hydrophobicity can be imparted onto an otherwise ink-receptive surface in the desired masking pattern, for example, by roughening the physical texture of the surface.

Described herein are capacitive devices and methods for producing same using printing methods such as flexography, gravure, offset, lithography, etc. The capacitive devices are formed from printing conductive inks, non-conductive inks, masking ink layers, graphic artwork layers, and overprint layers on a substrate. Interaction between a conductive ink layer of the capacitive device with a touch screen device of a computer, tablet, smart phone, etc. causes a capacitive effect that allows information coded in capacitive device to be read, leading to an activity such as the download of content to the device having the touch screen.

UV-curable interlayer compositions are provided. An interlayer composition may contain a polyallyl isocyanurate compound, an ester of -mercaptopropionic acid, a monofunctional (meth)acrylate monomer having one or more cyclic groups, and a photoinitiator. Processes of using the interlayer compositions to form multilayer structures and the multilayer structures are also provided.

The present disclosure provides an assembly method of an electronic device. The assembly method includes: opening an upper cover of a loading mechanism on a circuit board, in which the upper cover has an opening, and when the upper cover is in a closed state, the opening exposes a central processing unit socket located on the circuit board; snapping an elastic sheet to opposite sides of an inner edge of the opening of the upper cover through buckling portion of the elastic sheet; and closing the upper cover of the loading mechanism so that an elastic sheet body of the elastic sheet covers the central processing unit socket.