An electronic apparatus according to various embodiments of the present disclosure may include: a communication circuit that is communicatively connected to a solder printing apparatus and a measurement apparatus; one or more memories; and one or more processors. One or more processors may be configured to: acquire a first control parameter set of the solder printing apparatus for printing solder on a first substrate; transmit information indicating the first control parameter set to the solder printing apparatus; acquire first solder measurement information indicating a state of the solder printed on the first substrate; determine a first yield for the first substrate based on the first solder measurement information; and generate a model for searching for an optimal control parameter set based on a first data pair including the first control parameter set and the first yield.

A molecular ink contains a silver carboxylate (e.g. silver neodecanoate), a solvent (e.g. terpineol) and a polymeric binder comprising a polyester, polyimide, polyether imide or any mixture thereof having functional groups that render the polymeric binder compatible with the solvent. Such an ink may have good thermal stability with higher silver carboxylate content.

Provided is an ink for use in electronic component production making use of screen printing, which is suitable for actually allowing fine lines with high precision to be drawn in screen printing, and for actually allowing successive screen printing operations to be performed. The ink for screen printing of the present invention includes surface-modified silver nanoparticles (A) and a solvent (B), and has a viscosity at a shear rate of 10 (1/s) and 25° C. of 60 Pa.Math.s or more. The surface-modified silver nanoparticles (A) each include a silver nanoparticle and an amine-containing protective agent coating the silver nanoparticle. The solvent (B) includes at least a terpene solvent. In solvent (B), a content of solvents having a boiling point of less than 130° C. is 20 wt % or less based on the total amount of solvents.

A method of producing a functional vehicle component includes fixing a leather sheet over a surface of a vehicle component, applying a flexible electronic circuit to an A-surface of the leather sheet, and arranging a pigmented coating over the circuit. The pigmented coating inhibits or prevents the circuit from being visible through the pigmented coating. The method may include attaching an electronic element, such as a light source, a sensor, a wireless transmitter, or a switch, to the circuit. When the circuit includes a light source, the pigmented coating inhibits or prevents the light source from being visible through the pigmented coating, but light emitted by the light source is visible through the pigmented coating.

A stencil printing system for printing solder paste on a base substrate to establish an electrical connection is provided. The system includes a stencil configured to removably attach or rest on an upper surface of the base. The stencil has an opening that provides access to the upper surface of the base. A squeegee spreads conductive paste across the stencil, whereupon the paste can be forced onto the upper surface of the base via the opening. In embodiments, the stencil has a stepped edge at the boundary of the opening. The stepped edge may include a platform or floor that sits lower than the upper surface of the stencil to collect the paste and reduce the amount of paste that falls back to the base as the stencil is removed. The squeegee may have a lower surface that extends oblique relative to the squeegee's leading surface and trailing surface.

A squeegee drip collection system is configured to receive assembly material from at least one squeegee blade of the print head assembly. The squeegee drip collection system includes a paste shield coupled to the print head gantry and configured to be moved between a retracted position in which the paste shield is spaced from the at least one squeegee blade and an extended position in which the paste shield is positioned under the at least one squeegee blade. The squeegee drip collection system further includes a paste shield removal assembly configured to uncouple the paste shield from the print head gantry and to remove the paste shield.

A method for producing a flat feature on a substrate, comprises the steps of printing a deposit of print medium onto the substrate, the printed deposit comprising an upper surface, modifying the upper surface of the printed deposit, for example by partially drying the printed deposit, and levelling the modified deposit to produce a flat feature.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.