A conductive transfer for application to an article comprises first and second non-conductive layers and a conductive layer positioned between the two non-conductive layers. The conductive transfer further comprises an adhesive layer for adhering the conductive transfer to an article, such as a wearable item. The conductive layer comprises a plurality of tessellated cells defined by a printed conductive ink. The conductive layer comprises a main element and an input track with the plurality of tessellated cells being comprised over the input track of said conductive layer.

The invention concerns a display device including a transfer substrate (1010) including electric connection elements (L1, L2, C1, C2, P1, P2, P3, P4), and a plurality of semiconductor chips, wherein the transfer substrate (1010) includes an insulating plate, the electric connection elements of the substrate being formed by printing, on a surface of said plate, of a first conductive level, followed by an insulating level, followed by a second conductive level, the electric connection elements of the substrate including: a plurality of first conductive tracks (L1, L2) formed in the first conductive level; a plurality of second conductive tracks (C1, C2) formed in the second conductive level; and for each chip of the device, a plurality of electric connection areas (P1, P2, P3, P4) respectively connected to connection terminals of the chip, said areas being all formed in the second conductive level.

A screen-printing machine includes a mask holding device; a board holding device configured to grip a board; a positioning device to relatively position the board and the mask; and a control device. The board holding device includes a lifting and lowering table positioned in an up-down direction by a lifting and lowering mechanism, and a backup block including a mounting surface on which the board is placed, an installation surface disposed parallel to the mounting surface on an opposite side thereof, multiple suction holes to penetrate in a thickness direction between the mounting surface and the installation surface, and a chamber recessed section formed on an installation surface side so as to surround positions of the multiple suction holes, and in which an air chamber made by the chamber recessed section is configured when the backup block overlaps an upper face of the lifting and lowering table.

Disclosed is a wiring board, including: a base body having insulating properties; and a wiring conductor positioned on the base body. The base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and the fourth surface is an installation surface.

Heights of components or parts thereof are measured within a printing machine by measuring their relative rather than absolute heights. A virtual surface may be constructed from the measured heights, with a tolerance level employed based on the virtual surface. The invention is particularly suited to measurement of tooling components within a printing machine, such as tooling pins.

Methods of manufacturing a wound monitoring and/or therapy apparatus and/or wound dressing include positioning electronic components and connections in regions of a substrate that are not configured to be perforated. The methods can also include following a set of rules for positioning the components as well as positioning and shaping the connections based on the constraints stemming from, among other things, the positioning of the perforations on the substrate and with the goal of maintaining acceptable levels of signal integrity. The methods further include manufacturing a multi-layered substrate. Wound monitoring and/or therapy apparatus manufactured using such methods are also disclosed.

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.

A deposition apparatus includes a first substrate support for supporting a substrate in a substantially vertical orientation. The substrate has a first main surface, a second main surface opposite the first main surface and a side surface between the first main surface and the second main surface. The deposition apparatus includes a first deposition device for depositing a first conductive pattern or a first resist mask on the side surface of the substrate while the substrate is supported in the substantially vertical orientation by the first substrate support.

The present application provides a method for improving colour difference of an LED display screen, comprising: drilling and polishing circuit surfaces of a plurality of LED substrates; performing screen printing on the circuit surfaces of the plurality of LED substrates, and performing oil skimming on a mesh screen during the screen printing every other preset printing cycle in such a way that an ink on the mesh screen has a viscosity within a predetermined viscosity range; performing an exposure setting process on the plurality of LED substrates that have been screen printed to obtain a plurality of LED printed circuit boards; and finally assembling the plurality of LED printed circuit boards to form an LED display screen.