A circuit forming method, comprising: a coating step of applying a metal-containing liquid and a metal paste in an overlapping manner on a base, the metal-containing liquid containing fine metal particles and the metal paste containing a resin binder and metal particles larger than the fine metal particles in the metal-containing liquid; and a heating step of making the metal-containing liquid and the metal paste coated in the coating step conductive by heating the metal-containing liquid and the metal paste.

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

In an example, an apparatus includes processing circuitry comprising a model assessment module to identify an indication of a conductive element within object model data representing an object to be printed and a print instruction module to generate print instructions to generate the object. The print instructions may include an instruction to print conductive agent to form the conductive element and an instruction to print a fusing agent comprising an instruction to reduce an amount of fusing agent to be printed in a region of the conductive element compared to at least one other region of the object.

A method may include providing a fluid material, solidifying the fluid material, providing a substrate, and depositing the solidified fluid material on the substrate. Providing the fluid material may include providing a mold, and filling the mold with the fluid material. Solidifying the fluid material may include solidifying the fluid material in a mold, and removing the solidified fluid material from the mold. Providing the substrate may include preparing the substrate for deposition of the solidified fluid material, and adjusting the temperature of the substrate. Depositing the solidified fluid material on the substrate may include fixturing the substrate, and loading the solidified fluid material in a deposition tool. The fluid material may include a liquid phase component, and a solid phase component. The solid phase component may include particles suspended in the liquid phase component. The liquid phase component may include a gallium alloy.

A system and method of additively manufacturing a part including electrically conductive or static dissipating fluorine-containing polymers. The method includes depositing fluorine-containing polymer additive manufacturing material onto a build platform, selectively cross-linking portions of the deposited additive manufacturing material, and curing the selectively cross-linked portions such that the part is at least one of electrically conductive and static dissipating.

Provided is a conductive pattern according to an embodiment of the present invention formed on a surface of an inorganic insulating material (12), the conductive pattern having a lower layer (16A) in direct contact with the surface of the inorganic insulating material (12), and a metal nanoparticle sintered material-containing layer (18A) formed on the lower layer (16A). The lower layer (16A) and the metal nanoparticle sintered material-containing layer (18A) are formed using, for example, an ultra-fine inkjet processing device.

A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.

An ejector for jetting a viscous medium onto a substrate is disclosed. The ejector comprises a jetting chamber adapted to accommodate the viscous medium, a nozzle communicatively connected to the chamber, and an impacting device adapted to impact a volume of the viscous medium in the chamber such that viscous medium is jetted through the nozzle towards the substrate. The ejector may further comprise a rotating mechanism adapted to rotate the impacting device around a length axis of the impacting device such that shearing is induced in the viscous medium to be jetted. A corresponding system and method is also disclosed.

A method of forming a multi-layered printed circuit board (PCB) may include, with a printing device, delivering a flexible medium to at least one fluid jet printhead. Printing an electrically conductive fluid on the flexible medium may be performed with at least one fluid jet printhead, to form a first conductive layer on the flexible medium. With the at least one fluid jet printhead, an electrically insulating fluid may be printed on the first conductive layer to form at least one insulating layer on the first conductive layer. With the at least one fluid jet printhead, the electrically conductive fluid may be printed on the at least one insulating layer to form a second conductive layer.

Processes for modifying a surface geometry of a thermoplastic part are provided. One process includes placing a thermoplastic part in proximity to a head of an extruder; positioning the extruder head relative to a surface of the thermoplastic part; extruding plasticized material from the extruder head to the surface of the thermoplastic part such that the plasticized material exerts a first melt pressure on both of the extruder head and the thermoplastic part; moving the extruder head from a first position to a second position corresponding on the surface; producing a portion of plasticized material having a thickness that is substantially constant between the first position and the second position; and cooling the plasticized material to fuse it to the surface. The head may be movable on guide rails, and the surface and head may be urged to a predetermined position relative to each other by one or more springs.