Provided is a conductive film that can be formed without using a vacuum deposition method and includes a material that is neither a noble metal nor a special carbon material as a conductive element for exhibiting conductivity. The conductive film provided includes an arrangement portion of semiconductor nanoparticles. When a cross section including the arrangement portion is observed, the semiconductor nanoparticles are arranged in line apart from each other in the arrangement portion. A conductivity C1 measured along at least one direction is 7 S/cm or more.

A bidirectional self-healing neural interface includes a first elastic substrate; a neural electrode disposed on the first elastic substrate and comprising a conductive polymer composite; and a second elastic substrate disposed on the neural electrode. The conductive polymer composite includes a matrix formed of a self-healing polymer material; and a plurality of electrical conductor clusters distributed in the matrix. Each of the electrical conductor clusters includes particles of a first electrical conductor; and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor, and having sizes that are smaller than those of the particles of the first electrical conductor. The first electrical conductor is a source for generating the second electrical conductor. The neural interface has excellent elasticity, electrical conductivity that is improved by deformation, and is self-healing.

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

An implantable electrical connecting device includes a first elastic multi-ply layer and a second elastic multi-ply layer. The first elastic multi-ply layer has a first electrically conductive layer and a plurality of first electrical contacts electrically conductively connected to the first electrically conductive layer of the first elastic multi-ply layer. The second elastic multi-ply layer has a first electrically conductive layer and a plurality of second electrical contacts electrically conductively connected to the first electrically conductive layer of the second elastic multi-ply layer. The second electrical contacts make contact with the first electrical contacts.

An inductor assembly and a manufacturing method for an inductor assembly are provided. The inductor assembly includes a circuit board, a magnetic component, and a winding wire. The circuit board defines a groove body, the magnetic component is embedded in the groove body, and the winding wire is arranged on the magnetic component, surrounds along a thickness direction of the magnetic component, and is electrically connected to the circuit board

Systems and methods for producing electromagnetic devices are provided. The systems and methods allow for an electromagnetic device having both a substrate (e.g., polymer) and conductive material (e.g., metal) to be manufactured without using masks or other outside objects disposed over a surface (e.g., the substrate) onto which the conductive material is deposited. In one exemplary embodiment, the method includes performing additive manufacturing using a polymer to produce a device having a plurality of interconnected walls and a plurality of frequency selective surface elements, and then coating portions of the device with a conductive material. A plurality of shadowing features are formed as part of one or more of the walls to protect the frequency selective surface elements from being coated by the conductive material. Other methods, and a variety of systems that can result from the disclosed methods, are also provided.

A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, depositing a mono-layer of a selected silane composition on a surface of the metal structure with a vapor of the selected silane composition, and coating the treated surface with an organic material.

The present application provides a circuit board and a manufacturing method therefor. The circuit board includes: a core board, at least one chip, a first circuit layer, and a first insulating layer. A groove body is formed on the core board. The chip is provided in the groove body. The chip is provided with a first lead-out terminal. The first circuit layer is provided on at least one side of the core board. The first insulating layer is provided between the core board and the first circuit layer. The first lead-out terminal passes through the first insulating layer and is connected to the first circuit layer, so that the chip is electrically connected to the first circuit layer. Thus, the wiring between the chip and the circuit is more flexible.

A method for manufacturing a display substrate, a display substrate, a display panel and a display device are provided. The method includes: disposing a mask plate including an occlusion area above a base substrate, an orthographic projection of occlusion area on the base substrate partially overlapping a folding area of the base substrate; forming an inorganic layer pattern with an opening on the base substrate by using mask plate, an orthographic projection of opening on the base substrate partially overlapping the folding area of base substrate. An orthographic projection of opening on the base substrate partially overlaps the folding area of base substrate. The folding area of base substrate is occluded by mask plate. The inorganic layer is formed on the base substrate by using mask plate. Effect of conveniently and quickly removing a portion the inorganic layer located in the folding area can be achieved without removing the portion.

A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.