A film and a flexible metal-clad laminate obtained with the film. The laminate is improved in post-moisture absorption solderability. The film comprises a heat-resistant polyimide film and, disposed on at least one side thereof, an adhesive layer containing a thermoplastic polyimide. It is characterized in that the thermoplastic polyimide contained in the adhesive layer has crystallinity and that the film, when analyzed with a differential scanning calorimeter, has an endothermic peak attributable to the melting of the crystalline thermoplastic polyimide, the absolute value of the area of the peak being 4.0 mJ/mg or larger. The flexible metal-clad laminate is characterized by comprising the film and a metal layer disposed thereon.

A slot antenna for a cellular communications system includes a tubular dielectric support that extends along a longitudinal axis, a metal layer substantially circumferentially surrounding the tubular dielectric support, the metal layer including a first longitudinally-extending slot therein in which the metal is omitted and a feed network that includes a transmission line that crosses the first longitudinally-extending slot.

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

Systems and methods for producing electromagnetic devices are provided. The systems and methods allow for an electromagnetic device having both a substrate (e.g., polymer) and conductive material (e.g., metal) to be manufactured without using masks or other outside objects disposed over a surface (e.g., the substrate) onto which the conductive material is deposited. In one exemplary embodiment, the method includes performing additive manufacturing using a polymer to produce a device having a plurality of interconnected walls and a plurality of frequency selective surface elements, and then coating portions of the device with a conductive material. A plurality of shadowing features are formed as part of one or more of the walls to protect the frequency selective surface elements from being coated by the conductive material. Other methods, and a variety of systems that can result from the disclosed methods, are also provided.

The present invention relates to visible components with a functional coating in the interior and exterior of motor vehicles and a method for the production thereof.

A method for manufacturing a display substrate, a display substrate, a display panel and a display device are provided. The method includes: disposing a mask plate including an occlusion area above a base substrate, an orthographic projection of occlusion area on the base substrate partially overlapping a folding area of the base substrate; forming an inorganic layer pattern with an opening on the base substrate by using mask plate, an orthographic projection of opening on the base substrate partially overlapping the folding area of base substrate. An orthographic projection of opening on the base substrate partially overlaps the folding area of base substrate. The folding area of base substrate is occluded by mask plate. The inorganic layer is formed on the base substrate by using mask plate. Effect of conveniently and quickly removing a portion the inorganic layer located in the folding area can be achieved without removing the portion.

Graphene ink compositions comprising nitrocellulose and related methods of use comprising either thermal or photonic annealing.

A glass wiring substrate includes: a glass substrate 10, a first wiring portion 20 being formed on a first surface 10A of the glass substrate 10, a second wiring portion 30 being formed on a second surface 10B opposite to the first surface 10A; a through-hole 40 formed in a region of the glass substrate 10 in which the first wiring portion 20 and the second wiring portion 30 are not formed, the through-hole 40 having a diameter on a second surface 10B side larger than a diameter on a first surface 10A side; and a through-hole portion 41 formed in the through-hole 40, one end portion 42 of the through-hole portion 41 extending to the first wiring portion 20, the other end portion 43 of the through-hole portion 41 extending to the second wiring portion 30, in which a wiring pitch P.sub.1 of the first wiring portion 20 in the vicinity of the through-hole portion 41 is narrower than a wiring pitch P.sub.2 of the second wiring portion 30 in the vicinity of the through-hole portion 41.

A printed wiring board includes a first conductor layer, a resin insulating layer, a second conductor layer, and a via conductor formed in an opening of the insulating layer and connecting the first conductor and second conductor layers. The second conductor layer and via conductor include a seed layer having a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface in the opening, and a third portion formed on a portion of the first conductor layer exposed by the opening. A thickness of the first portion is greater than a thickness of the second portion and a thickness of the third portion. The seed layer includes a first layer including an alloy including copper, aluminum and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium, and a second layer formed on the first layer and including copper.

A flexible printed circuit is described that includes a flexible supporting substrate having a first face and a second face. A conductive material is deposited by vacuum deposition on at least one of the first face or the second face of the flexible supporting substrate. A flexible conductive circuit is formed on the conductive material by electrical discharge machining. The flexible conductive circuit defines a plurality of electrical component placement circuits to which electrical components may be attached. The flexible printed circuit can be rolled or folded. The flexible printed circuit can also be made in sizes much larger than is currently possible with other competing technologies.