A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.

An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.

A method of forming an overmolded plastic structure on a metallic plate includes first bonding a component to the metallic plate. The component is bonded with an adhesive that adheres it to the metallic plate. A plastic structure is formed over at least a portion of the component and the metallic plate and the plastic structure primarily adheres to the component. The component can be a set of metallic signal conductors that are used to route electrical signals across the metallic plate and the adhesive can be used to electrically insulate the signal conductors from the metallic plate.

Disclosed is a ceramic substrate manufacturing method in which a copper sheet is etched and then bonded to a ceramic substrate, so that the ceramic substrate has reduced to overall processing time and improved reliability and product lifespan. The disclosed ceramic substrate manufacturing method comprises the steps of: etching a copper sheet so as to prepare a metal substrate; etching a ceramic substrate so as to prepare a unit ceramic substrate; assembling the metal substrate and the unit ceramic substrate; bonding the metal substrate and the unit ceramic substrate so as to form a stack; partially printing a metal paste on the surface of the stack; and sintering the metal paste.

The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil and a conductor pattern on the surface of the conductor foil. A component is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern.

A printed circuit board includes a first insulating layer; a first circuit pattern embedded in the first insulating layer; a second insulating layer disposed on the first insulating layer; a via hole penetrating at least a portion of each of the first and second insulating layers; and an adhesive layer disposed on at least a portion of a side surface of the via hole.

The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

There is provided a laminate in which a decrease in the release function of a release layer can be suppressed even when the laminate is heat-treated under either temperature condition of low temperature and high temperature. This laminate includes a carrier; an adhesion layer on the carrier and containing a metal M.sup.1 having a negative standard electrode potential; a release-assisting layer on a surface of the adhesion layer opposite to the carrier and containing a metal M.sup.2 (M.sup.2 is a metal other than an alkali metal and an alkaline earth metal); a release layer on a surface of the release-assisting layer opposite to the adhesion layer; and a metal layer on a surface of the release layer opposite to the release-assisting layer, and T.sub.2/T.sub.1, a ratio of a thickness of the release-assisting layer, T.sub.2, to a thickness of the adhesion layer, T.sub.1, is more than 1 and 20 or less.

Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

A manufacturing method of a circuit board is provided. A first carrier board included a substrate and a first conductive layer is provided, and the first conductive layer is located on a first surface of the substrate. A stainless steel layer is sputtered on the first conductive layer. An insulating layer is formed to cover a peripheral region of the stainless steel layer and expose a central region. A circuit structure layer is formed on the central region exposed by the insulating layer. A bottom surface of the circuit structure layer is connected to the first carrier board. A transferring procedure is performed to adhere a top surface of the circuit structure layer onto an adhesive layer of a second carrier board. The first carrier board is separated with the circuit structure layer to transfer the circuit structure layer onto the second carrier board, and expose the bottom surface of the circuit structure layer. The manufacturing method of the circuit board of the present invention is safer and simpler, may effectively reduce the manufacturing costs and improve the product yields.