Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N.sub.2 while controlling oxygen at 0-50 ppm O.sub.2, f) overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste, and g) stoving the printed ceramic substrate with N.sub.2 while keeping the oxygen content at 0-50 ppm O.sub.2.

Disclosed herein are a variety of embodiments of thick film circuits with conductive components formed using different conductive elements and related methods for forming such circuits. One embodiment consistent with the present disclosure includes a multi-level thick film circuit formed on a substrate and having a first layer disposed on the substrate. The first layer may include a first conductive component formed using a first conductive element. The first conductive element may be a precious metal. The circuit may further include a second layer having a second conductive component. The second conductive component may be formed using a second conductive element. In one embodiment, the second conductive element may be a base metal. At least a portion of the first conductive element may directly contact at least a portion of the second conductive element such that the first layer is in electrical communication with the second layer.

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

A method for stencil printing during manufacture of a printed circuit board includes forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, a scraper and conductive inks, forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials, forming words and marks on the circuit board using a third stencil, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste.

A printed circuit board is disclosed, comprising a plate body, a conductive pattern disposed on the plate body, a conductive metal plate, and a metal layer. The conductive metal plate has a first terminal and a second terminal, wherein the first terminal and the second terminal are fixed to the plate body. An accommodating space is between the conductive metal plate and the plate body. The metal layer covers the conductive metal plate and the conductive pattern, and is filled into the accommodating space. Therefore, a printed circuit board which has metal blocks with enough thickness is provided. The metal blocks can provide sufficiently low resistance to increase resistance efficiency of the printed circuit.

An electronic device having a printed circuit board is provided. In one embodiment, the printed circuit board includes a plurality of external pads to be coupled with an external device and a plurality of bypass pads for testing an electric circuit. The external pads are exposed and at least one of the plurality of bypass pads are not exposed from an outer surface of the PCB. A system using the electronic device and a method of testing an electronic device are also provided.

Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.

A method for forming a transparent electrode includes a step of forming a thin metal wire on a transparent substrate; and a step of forming a transparent conductive layer on the transparent substrate and the thin metal wire. The step of forming the transparent conductive layer is a step of forming the transparent conductive layer by applying an application liquid onto the transparent substrate and the thin metal wire by printing. The application liquid is composed of a conductive polymer, a water-soluble binder having a structural unit represented by the following general formula (I), a polar solvent having a log P value of 1.50 to 0.45, and 5.0 to 25 mass % of a glycol ether. ##STR00001##

A printed circuit board is disclosed, comprising a plate body, a conductive pattern disposed on the plate body, a conductive metal plate, and a metal layer. The conductive metal plate has a first terminal and a second terminal, wherein the first terminal and the second terminal are fixed to the plate body. An accommodating space is between the conductive metal plate and the plate body. The metal layer covers the conductive metal plate and the conductive pattern, and is filled into the accommodating space. Therefore, a printed circuit board which has metal blocks with enough thickness is provided. The metal blocks can provide sufficiently low resistance to increase resistance efficiency of the printed circuit.

The present invention relates to a method for manufacturing a board that includes a conductive pattern, which comprises the steps of 1) discharging a conductive inorganic composition that includes a conductive inorganic metal particle on a substrate; 2) discharging a conductive organic composition that includes a conductive organic metal complex on the conductive inorganic composition; and 3) sintering the conductive inorganic composition and the conductive organic composition, and a board that includes a conductive pattern manufactured by using the same. A board that includes a conductive pattern according to the present invention may have high conductivity even though it is sintered at a lower sintering temperature than a board that includes a conductive pattern formed by using only an organic material or only an inorganic material.