A wearable monitoring device comprising a printed circuit board having a first side and a second side opposite the first side, wherein the printed circuit board is configured to couple to at least one sensor configured to monitor a physiological condition; at least a first padding layer coupled to the printed circuit board proximate the first side; at least a second padding layer coupled to the printed circuit board proximate the second side; a first protective layer coupled to the first padding layer opposite the printed circuit board; a second protective layer coupled to the second padding layer opposite the printed circuit board; at least one additional layer between the first protective layer opposite the printed circuit board; the first protective layer and the second protective layer seal together and enclose the first and second padding and the printed circuit board; and a power source coupled to the printed circuit board.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10.sup.−10 cc.Math.cm/cm.sup.2.Math.sec.Math.cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.

An electronic device (100) comprises a stretchable substrate (30) with a flap (30f) formed by a cut (40) in the substrate (30). The flap (30f) is disconnected by the cut (40) from a surrounding main section (30m) of the substrate (30) except on one side. The flap (30f) is exclusively connected to the main section (30m) via a connected section (30c) of the substrate (30) between two ends (40a, 40b) of the cut (40). An electronic component (10) is disposed on the flap (30f) with electrical contacts (11,12) connected to conductive tracks (21,22) disposed on the substrate (30). The conductive tracks (21,22) extend between the component (10) disposed on the flap (30f), and other parts (10r) of the electronic device (100) outside the flap (30f) via the connected section (30c). The flap (30f) with the component (10) is disposed in a pocket formed by surrounding lamination layers (31,32).

A flexible board includes a flexible resin base material, a conductor pattern on a principal surface of the resin base material and including first and second electrodes electrically separated from each other, a first protective film having lower flexibility than the resin base material and covering a portion of the conductor pattern, and a second protective film having higher flexibility than the first protective film and extending over the principal surface of the resin base material and the first protective film to cover another portion of the conductor pattern. The first protective film is closer to the first and second electrodes on the principal surface of the resin base material than the second protective film. The first protective film includes a first opening exposing a portion of the first electrode and a second opening exposing a portion of the second electrode in planar view.

A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.

A display device including a display module configured to display an image, a printed circuit board provided below the display module, and a flexible substrate including a first bonding region, a bending region, and a second bonding region. The flexible substrate may be bent at the bending region and may be used to connect the display module to the printed circuit board. The flexible substrate may include a circuit layer electrically connecting the display module to the printed circuit board, a cover layer on the circuit layer, and a bubble-prevention layer, which is provided between the cover layer and the circuit layer and is overlapped with each of the first and second bonding regions of the flexible substrate.

A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the insulating layer, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

An extensible and contractible wiring board that includes an extensible and contractible wiring sheet having an extensible and contractible resin sheet and an extensible and contractible wiring on the extensible and contractible resin sheet, the extensible and contractible wiring including a conductive particle, a resin, and a void at an interface between the conductive particle and the resin; and a fixing sheet on a main surface of the extensible and contractible wiring sheet.