Patent classifications
H05K3/281
Display device
Provided is a display device including: a display panel in which a display area and a non-display area located around the display area are defined; an external device which is disposed on the non-display area of the display panel; and a cover member which is disposed on the external device, wherein the external device includes a driving chip and a printed circuit film which is disposed on the non-display area of the display panel and spaced apart from the display area with the driving chip interposed between the printed circuit film and the display area in plan view, and the cover member includes a first insulating tape disposed on the external device, a first conductive tape disposed on the first insulating tape and a second insulating tape disposed on the first conductive tape, wherein the second insulating tape includes an electrostatic induction opening penetrating the second insulating tape in a thickness direction, a planar size of the first conductive tape is greater than a planar size of the second insulating tape, the first conductive tape protrudes further toward the display area than the second insulating tape in plan view, and the electrostatic induction opening is disposed on a part of the first conductive tape which protrudes further toward the display area than the second insulating tape.
Display module and display device
A display module includes a display panel, a flexible circuit board, a driving control chip, a touch control chip and a protective structure. The flexible circuit board is bonded to the display panel. The driving control chip is located on the display panel or the flexible circuit board. The touch control chip is located on the flexible circuit board or the display panel. The protective structure covers the driving control chip and/or the touch control chip. And the protective structure includes a first insulating layer, a heat dissipation layer and an electromagnetic shielding layer that are sequentially disposed away from the display panel.
Fluidic conductive trace based radio-frequency identification
In some examples, a fluidic conductive trace based radio-frequency identification device may include a flexible substrate layer including a channel, and a trace formed of a conductive fluid that is disposed substantially within the channel. The fluidic conductive trace based radio-frequency identification device may further include a sealing layer disposed on the flexible substrate layer and the trace to seal the conductive fluid in a liquid state within the channel.
Display device including flexible substrate with bubble-prevention layer
A display device includes a display module configured to display an image, and a flexible substrate including a first bonding region connected to the display module, with the flexible substrate bent such that a portion thereof is disposed under the display module. The flexible substrate may include a circuit layer electrically connecting the display module to a printed circuit board, a cover layer on the circuit layer, and a bubble-prevention layer disposed between the cover layer and the circuit layer and configured to overlap with the first bonding region, wherein the display module includes a non-display region surrounding a display region, the non-display region includes a pad region to which the flexible substrate is connected, and the bubble-prevention layer overlaps the pad region, and the bubble-prevention layer does not overlap the display area.
Airwaves-passing-type heat dissipation sheet and communication module comprising same
The communication module according to one embodiment of the present invention comprises: a printed circuit board; an antenna unit and electronic components arranged on the printed circuit board; and a sheet layer arranged on the antenna unit and the electronic components, wherein the sheet layer comprises 15-35% of a polymer resin and 65-85 wt % of flat boron nitride, the flat boron nitride has an average particle size (D50) of 40 to 50 μm, a D10 of 10 to 25 μm, and a D90 of 75 to 85 μm, and the θ50 of the flat boron nitride is arranged to form an angle of 40° or less with horizontal components of the sheet layer.
Flexible board, method for manufacturing the same, and electronic device
A flexible board includes a flexible resin base material, a conductor pattern on a principal surface of the resin base material and including first and second electrodes electrically separated from each other, a first protective film having lower flexibility than the resin base material and covering a portion of the conductor pattern, and a second protective film having higher flexibility than the first protective film and extending over the principal surface of the resin base material and the first protective film to cover another portion of the conductor pattern. The first protective film is closer to the first and second electrodes on the principal surface of the resin base material than the second protective film. The first protective film includes a first opening exposing a portion of the first electrode and a second opening exposing a portion of the second electrode in planar view.
Flexible circuit board including bending part with improved shielding properties and manufacturing method thereof
An antenna carrier includes a flexible circuit board, the flexible circuit board comprising: a first dielectric formed to include a width direction and a length direction; a first signal line positioned on one side in the width direction of an upper surface or a lower surface of the first dielectric; a second signal line spaced apart from the first signal line to the other side in the width direction and positioned on the upper surface or the lower surface of the first dielectric; a second dielectric positioned on one side in the width direction above the first dielectric and having the first signal line positioned below the second dielectric; a third dielectric spaced apart from the second dielectric to the other side in the width direction and positioned below the first dielectric, and having the second signal line positioned above the third dielectric; a first ground; and a second ground.
Roll-To-Roll Additive Manufacturing Method and Device
A flexible laminate electronic device includes a flexible substrate that includes electrical connections between electronic components attached to the flexible substrate. A first flexible additive layer includes apertures, wherein at least one of the one or more electronic components is aligned in one of the apertures. A subsequent flexible additive layer is disposed over the first flexible additive layer and aligned around respective portions of the electronic components protruding above the first flexible additive layer. A flexible cover layer is placed over the subsequent flexible additive layer.
DEVICE FOR CONNECTING A SMART CARD TO A TEXTILE AND METHOD FOR MANUFACTURING ELECTRONIC CARDS IN A FLEXIBLE SMART CARD FORMAT
Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.
ADHESIVE COMPOSITION, COVERLAY FILM COMPRISING SAME, AND PRINTED CIRCUIT BOARD
An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.