The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.

A flexible wiring substrate includes a main substrate having flexibility, a main wiring disposed over the main substrate, a second protective sheet covering the main wiring, and an insulating member partially covering the main wiring exposed from the second protective sheet and being thinner in thickness than the second protective sheet.

A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.

The present disclosure provides a photosensitive dry film enabling a photocured film being excellent in insulation reliability and resolution and having a frosted appearance to be obtained. A photosensitive dry film including a support film having a first main surface and a second main surface opposite to the first main surface, and a photosensitive resin layer provided on the first main surface, in which the first main surface has an irregular surface formed by chemical etching.

A mini smart card and a method of manufacturing the mini smart card are introduced. The method includes disposing bilayered print layers on a top side and a bottom side of a circuit layer, respectively; performing a heat-compression treatment and then a printing treatment on the circuit layer and the bilayered print layers; removing surface layers from the bilayered print layers; and disposing transparent protective layers on the bilayered print layers, respectively. The bilayered print layers are prevented from deforming under the heat generated during the printing treatment. Removal of the surface layers from the bilayered print layers effectively reduces the thickness of the mini smart card.

The disclosure relates to a power supply module. The power supply module may include a flexible substrate and a plurality of battery cells distributed in an array on one side of the flexible substrate. Adjacent battery cells of the plurality of battery cells on each line in a first direction may be connected in series by a flexible connector to form a plurality of lines of battery cells, and the plurality of lines of battery cells may be connected in parallel through a first electrode.

A printed circuit board, PCB, based connector for connecting at least one wire to at least one microswitch in a position sensor for a motorised valve assembly is provided comprising a PCB comprising at least one first through hole and at least one second through hole. The at least one first through hole is configured to receive a solder pin of at least one microswitch. The at least one second through hole is configured to receive at least one wire and the PCB further comprises a slot configured to receive the at least one wire with an interference fit.

A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

An objective is to provide a stretchable conductor sheet which is useful as a material for electrical wiring and electrodes for garment-type electronic devices, the material having excellent durability in terms of washing and durability in terms of perspiration. A fabric provided with an electrode and an electrical wiring, which are formed from a stretchable conductor sheet, is obtained by: providing a film having releasability with a first stretchable conductor layer which is formed from a paste material that uses carbon-based particles as a conductive filler, while using a flexible resin as a binder resin; subsequently forming a second stretchable conductor layer, while using metal-based particles as a conductive filler; laminating a hot melt adhesive layer thereon; superposing the resulting laminate on a fabric after removing unnecessary parts from the laminate by means of partial slits; and subjecting the resulting fabric to hot pressing. Since the carbon-based particles adsorb a contamination substance of the metal-based particles, oxidation degradation and sulfuration degradation of the metal-based particles is reduced, thereby improving the durability.

A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 μm, and the thickness of the low dielectric glue layer is between 3 to 25 μm, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 μm. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.