Colored thin covering film and manufacturing method

Abstract

A colored thin covering film is provided, including an upper detached layer, a colored ink film, a low dielectric glue layer, and a lower detached layer. The color ink layer is formed between the upper detached layer and the low dielectric glue layer. The low dielectric glue layer is formed between the colored ink layer and the lower detached layer. The thickness of the colored ink layer is between 1 to 10 μm, and the thickness of the low dielectric glue layer is between 3 to 25 μm, such that a total thickness of the colored ink layer and the low dielectric glue layer is allowed to be between 4 to 35 μm. The colored thin covering film has an extremely low dielectric constant and loss, extremely low ion migration, good adhesion, heat dissipation, high flexibility, and low resilience, and can be processed in a low temperature.

Claims

1. A colored thin covering film, comprising: an upper detached layer; a colored ink layer formed on the upper detached layer and having a thickness of from 1 μm to 10 μm; a low dielectric glue layer formed on the colored ink layer to sandwich the colored ink layer between the upper detached layer and the low dielectric glue layer, the low dielectric glue layer having a thickness of from 3 μm to 25 μm for a total thickness between the colored ink layer and the low dielectric glue layer to be from 4 μm to 35 μm; and a lower detached layer formed on the low dielectric glue layer to sandwich the low dielectric glue layer between the colored ink layer and the lower detached layer, wherein the low dielectric glue layer comprises sintered silicon dioxide, polytetrafluoroethylene, a fluorine-based resin excluded from polytetrafluoroethylene, a phosphorus-based flame retardant, and a polyimide resin, with a total content of the sintered silicon dioxide, the polytetrafluoroethylene, the fluorine-based resin excluded from polytetrafluoroethylene, and the phosphorus-based flame retardant to be from 8 wt % to 50 wt % of a total solid content of the low dielectric glue layer, and the polyimide resin has a content from 40 wt % to 90 wt % of the total solid content of the low dielectric glue layer, wherein the sintered silicon dioxide has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer, the polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, the fluorine-based resin excluded from polytetrafluoroethylene has a content from 2 wt % to 10 wt % of the total solid content of the low dielectric glue layer, and the phosphorus-based flame retardant has a content from 2 wt % to 15 wt % of the total solid content of the low dielectric glue layer.

2. The colored thin covering film of claim 1, wherein the low dielectric glue layer has a Dk value of from 2.4 to 2.8 at 10 GHz, and a Df value of from 0.002 to 0.006 at 10 GHz.

3. The colored thin covering film of claim 1, wherein the low dielectric glue layer has a water absorption rate of from 0.05% to 0.2%.

4. The colored thin covering film of claim 1, wherein the low dielectric glue layer has an insulation resistance between wires greater than 10.sup.11Ω, a surface resistance greater than 10.sup.12Ω, and a volume resistance greater than 10.sup.13 Ω.Math.cm.

5. The colored thin covering film of claim 1, wherein the colored ink layer is composed of at least one resin selected from the group consisting of an epoxy resin, an acrylic resin, an urethane resin, a silicon rubber resin, a poly-p-xylene resin, a bismaleimide-based resin, a polyimide resin, a polyamideimide resin, and a polyamide resin.

6. The colored thin covering film of claim 1, wherein at least one of the upper detached layer and the lower detached layer is composed of at least one polymer independently selected from the group consisting of polypropylene, biaxially oriented polypropylene, and polyethylene terephthalate.

7. The colored thin covering film of claim 1, wherein the colored ink layer comprises at least one of an inorganic pigment and an organic pigment.

8. The colored thin covering film of claim 7, wherein the inorganic pigment is cadmium red, cadmium lemon yellow, cadmium yellow orange, titanium dioxide, carbon black, black iron oxide, or black complex inorganic pigment.

9. The colored thin covering film of claim 7, wherein the organic pigment is aniline black, perylene black, anthraquinone black, benzidine-based yellow pigment, phthalocyanine blue, or phthalocyanine green.

10. The colored thin covering film of claim 1, wherein the colored ink layer has a thickness of from 3 μm to 5 μm.

11. The colored thin covering film of claim 1, wherein the low dielectric glue layer has a thickness of from 3 μm to 10 μm.

12. A method for preparing the colored thin covering film of claim 1, comprising: coating a colored ink raw material on a lower surface of the upper detached layer; curing the colored ink raw material at a temperature of from 50° C. to 180° C. to form the colored ink layer; forming the low dielectric glue layer on a lower surface of the colored ink layer with a coating process or a transfer printing process; and adhering the lower detached layer on a lower surface of the low dielectric glue layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram showing the structure of single-layered colored ink layer.

(2) FIG. 2 is a schematic diagram showing the structure of double-layered colored ink layer.

DETAILED DESCRIPTION OF EMBODIMENTS

(3) Hereafter, the present disclosure will be described with reference to specific embodiments, such that a person skilled in the art can easily understand the advantages and effects of the present disclosure disclosed in the specification.

(4) It should be noted that all of the structures, ratios, sizes and so on shown in the figures are used only for the purpose of illustrating the contents described in the specification, and for the understanding and reading of a person skilled in the art, rather than limiting conditions for implementing the present disclosure. Therefore, they do not have substantial meaning technically. Any modification of structure, alteration of proportional relation or adjustment of size, when not having the influence on effects and purposes of the present disclosure, should be deemed to fall within the scope contained in the technical contents of the present disclosure. Meanwhile, terms used herein such as “upper”, “first”, “second”, “a”, “an”, and “the” are also only used for the clarity of the description, rather than limiting the scope of the present disclosure for the implementation. Thus, the alteration or adjustment on the relative relation, which does not substantially change the technical contents, should be deemed as falling within the scope of the present disclosure.

(5) As shown in FIG. 1, the present disclosure provides a colored thin covering film including an upper detached layer 100, a colored ink layer 200, a low dielectric glue layer 300, and a lower detached layer 400, wherein the colored ink layer 200 is formed between the upper detached layer 100 and the low dielectric glue layer 300, and the low dielectric glue layer 300 is formed between the colored ink layer 200 and the lower detached layer 400.

(6) A total thickness of the colored ink layer 200 and the low dielectric glue layer 300 is 4 to 35 μm, wherein the colored ink layer 200 has a thickness of 1 to 10 μm, and the low dielectric glue layer 300 has a thickness of 3 to 25 μm.

(7) In addition, the low dielectric glue layer 300 has a Dk value of 2.4 to 2.8 (10 GHz), a Df value of 0.002 to 0.006 (10 GHz), a water absorption rate of 0.05 to 0.2%, an insulation resistance between wires greater than 10.sup.11Ω, a surface resistance greater than 10.sup.12Ω, and a volume resistance greater than 10.sup.13 Ω.Math.cm.

(8) The material forming the low dielectric glue layer 300 includes at least one resin selected from the group consisting of fluorine-based resins, epoxy resins, acrylic resins, urethane resins, silicon rubber resins, poly-p-xylene resins, bismaleimide-based resins, polyimide resins, polyamideimide resins, and polyamide resins.

(9) The extremely low dielectric glue layer 300 includes sintered silicon dioxide, polytetrafluoroethylene, a fluorine-based resin excluded from polytetrafluoroethylene, a phosphorus-based flame retardant, and a polyimide resin, wherein a total content of the sintered silicon dioxide, the polytetrafluoroethylene, the fluorine-based resin excluded from polytetrafluoroethylene and the phosphorus-based flame retardant is 8 to 50 wt % of the total solid content in the low dielectric glue layer, and a content of the polyimide resin is 40 to 90 wt % of the total solid content in the low dielectric glue layer.

(10) The material forming the colored ink layer 200 includes at least one resin selected from the group consisting of epoxy resins, acrylic resins, urethane resins, silicon rubber resins, poly-p-xylene resins, bismaleimide-based resins, polyimide resins, polyamideimide resins and polyamide resins.

(11) The upper detached layer 100 and the lower detached layer 400 are detached films or detached paper, and materials of the two include at least one polymer independently selected from the group consisting of polypropylene, biaxially oriented polypropylene, and polyethylene terephthalate.

(12) A content of the sintered silicon dioxide is 2 to 15 wt % of the total solid content of the low dielectric glue layer, a content of the polytetrafluoroethylene is 2 to 10 wt % of the total solid content of the low dielectric glue layer, a content of the fluorine-based resin excluded from polytetrafluoroethylene is 2 to 10 wt % of the total solid content of the low dielectric glue layer, and a content of the phosphorus-based flame retardant is 2 to 15 wt % of the total solid content of the low dielectric glue layer.

(13) The colored ink layer 200 includes an inorganic pigment or an organic pigment, wherein the inorganic pigment is cadmium red, cadmium lemon yellow, cadmium yellow orange, titanium dioxide, carbon black, black iron oxides, or black complex inorganic pigment; and the organic pigment is aniline black, perylene black, anthraquinone black, benzidine-based yellow pigment, phthalocyanine blue, or phthalocyanine green.

(14) The colored ink layer is a red, yellow, black, white, blue or green ink layer.

(15) If a matte surface of the colored ink layer is desired, an arbitrary combination of calcium sulfate, silicon dioxide, titanium dioxide, zinc sulfide, zirconium oxide, calcium carbonate and clay can be added into the ink layer for the purpose of extinction, thereby allowing the colored ink layer to be matte.

(16) The colored ink layer 200 has a thickness of 3 to 5 μm, the low dielectric glue layer 300 has a thickness of 3 to 10 μm. There is not a particular restriction on the thickness of the upper detached layer and the lower detached layer in the present disclosure.

(17) The manufacturing method of the colored thin covering film of the present disclosure includes the following steps:

(18) Step I: coating a colored ink raw material on a lower surface of the upper detached layer 100, and curing the colored ink raw material at 50° C. to 180° C. to form the colored ink layer 200; Step II: forming the low dielectric glue layer 300 on a lower surface of the colored ink layer 200 with a coating process or a transfer printing process; and Step III: adhering the lower detached layer 400 on a lower surface of the low dielectric glue layer 300.

(19) As shown in FIG. 2, another embodiment of the colored thin covering film of the present disclosure, the colored thin covering film includes, in sequence, an upper detached layer 100, a first colored ink layer 201, a second colored ink layer 202, a low dielectric glue layer 300 and a lower detached layer 400, i.e., there are two or even more colored ink layers. In one embodiment, each of the first ink layer 201 and the second ink layer 202 has a thickness of 2 to 3 μm. The double-layered stacking structure of the first colored ink layer 201 and the second colored ink layer 202 facilitates to solve the problem of micropore during the coating procedure.

(20) In a Table 1 below are specific weight percentages of the sintered silicon dioxide, the polytetrafluoroethylene, the fluorine-based resin excluded from polytetrafluoroethylene, the phosphorus-based flame retardant and the polyimide resin in the low dielectric glue layers of Examples 1-4 of the present disclosure.

(21) TABLE-US-00001 TABLE 1 Fluorine-based excuded from Phosphorus- Sintered polytetra- polytetra- based silicon fluoro- fluoro- flame Polyimide dioxide ethylene ethylene retardant resin (%) (%) (%) (%) (%) Ex. 1 10 7 5 2 76 Ex. 2 15 2 10 15 58 Ex. 3 2 5 8 10 75 Ex. 4 6 10 2 5 77

(22) Specific stacking structures of the low dielectric glue layer and the colored ink layers of Examples 1-4 are listed in Table 2 below, and they are compared with the current FPC boards in terms of property. Results thereof are listed in Table 2.

(23) TABLE-US-00002 TABLE 2 Thickness Thickness Resistance Insulation of the of the low Thermal Thermal to Dielectric resistance colored dielectric Total conductivity conductivity breakdown constant Dielectric between ink layer glue layer thickness coefficient K efficiency R voltage Dk loss Df wires (μm) (μm) (μm) (W/mk) (° C./W) (KV) (10 GHz) (10 GHz) (Ω/KV) Ex. 1 3 3 6 0.436 0.021 0.8 2.78 0.005 >10.sup.11 Ex. 2 3 5 8 0.392 0.032 1.0 2.70 0.005 >10.sup.11 Ex. 3 5 10 15 0.411 0.057 1.8 2.61 0.004 >10.sup.11 Ex. 4 5 20 25 0.358 0.108 2.5 2.50 0.004 >10.sup.11 Comp. — 25 25 0.300 0.129 3.4 2.40 0.003 >10.sup.11 Ex. 1

(24) Based on Table 2, the colored thin covering film has a higher thermal conductivity coefficient, lower thermal conductivity efficiency, lower resistance to breakdown voltage, and lower Dk/Df value.

(25) The above examples are provided for the purpose of illustration only, and are not intended to limit the present invention. A person skilled in the art can modify and alter the above examples without departing from the spirits and scopes of the present invention. Thus, the scope claimed by the present invention should be as listed in the appended claims.