A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.

A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.

An electronic control module, particularly for a transmission, includes a first circuit board element and a sensor unit carrier fastened to the first circuit board element. The sensor unit carrier has a sensor unit receptacle configured to receive a sensor unit. The sensor unit has a sensor element fastened and electrically connected to a second circuit board element so as to detect at least one measured value. The sensor unit is fastened in the sensor unit receptacle. The second circuit board element has a flexible region that separates a first sub-region of the second circuit board element from a second sub-region of the second circuit board element. The first sub-region has a predetermined angle to the second sub-region. The sensor element is electrically connected to the first circuit board element by the second sub-region of the second circuit board element.

A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.

A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).

An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.

The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

A twistable electronic device module including a twistable substrate, an electrode pattern layer, an insulating layer, a circuit layer, a plurality of circuit boards and a plurality of electronic devices is provided. The electrode pattern layer is disposed on the twistable substrate. The insulating layer is disposed on the electrode pattern layer. The edge of the insulating layer has an opening located at the edge of the twistable substrate and exposing a part of the electrode pattern layer. The circuit layer is disposed on the insulating layer and on the sidewall of the opening, and is connected with the electrode pattern layer. The plurality of circuit boards are disposed on the circuit layer, and each is electrically connected to the circuit layer. The plurality of electronic devices are disposed on the plurality of circuit boards, and each is electrically connected to a corresponding one of the plurality of circuit boards

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.