A conductive coating material is disclosed including at least (A) 100 parts by mass of a binder component including 5 to 30 parts by mass of solid epoxy resin that is solid at normal temperature and 20 to 90 parts by mass of liquid epoxy resin that is liquid at normal temperature, (B) 200 to 1800 parts by mass of silver-coated copper alloy particles in which the copper alloy particles are made of an alloy of copper, nickel, and zinc, the silver-coated copper alloy particles have a nickel content of 0.5% to 20% by mass, and the silver-coated copper alloy particles have a zinc content of 1% to 20% by mass with respect to 100 parts by mass of the binder component (A), and (C) 0.3 to 40 parts by mass of a curing agent with respect to 100 parts by mass of the binder component (A).

The present application discloses a filtering cable, which solves the problem that the cable in the related art cannot ensure a simple and reasonable structural design while having good filter performance. One or several core wires and N defective conductor layers surrounding the core wires are sequentially provided from inside to outside in the cross section in the radial direction of the filtering cable; wherein the defective conductor layer has an etching pattern; the etching pattern is distributed in the axial direction of the filtering cable; the etching pattern is used to make the filtering cable equivalent to a preset filter circuit to filter the signal transmitted in the filtering cable.

A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

The present invention addresses the problem of providing a protection member which is for a semiconductor and has excellent pattern retention at high temperatures and moisture resistance and has good adhesion to a semiconductor circuit, etc. for long period of time. The protection member which is for a semiconductor and solves said problem, includes a cured article of an organic polymerizable compound having a functional group containing an oxygen atom and/or a nitrogen atom. The absolute value of the difference between the linear expansion coefficient at 150° C. of the cured article and the linear expansion coefficient at 25° C. of the cured article is 55 or less.

Described herein are static dissipating coatings and thermally-stable static-controlled (TSSC) electronic circuits, comprising such coatings. Also described herein are methods of forming such coatings and circuits. In some examples, a static dissipating coating comprises a conductive polymer and a thermally-stable base polymer. The conductive polymer comprises polyaniline and, in some examples, a conductive agent, such as dinonylnaphthalene sulfonic acid (DNNSA), dodecyl benzene sulfonic acid (DBSA), and/or camphor sulfonic acid (CSA). The thermally-stable base polymer comprises one or more copolymers of butyl-methacrylate, such as poly-butylmethacrylate-co-methyl methacrylate (PBM). The amount of the conductive polymer is specifically controlled to ensure the coating's overall conductivity and thermal stability. In some examples, the conductive polymer concentration is at or less than 25% by weight. The conductivity of the coating is between 10.sup.−9 S/cm and 10.sup.−6 S/cm even after being exposed to 150° C. for up to 24 hours.

A multi-layer coating on an outer surface of a substrate includes a first layer applied directly to the outer surface of the substrate. The first layer includes diamond-like carbon (DLC) configured to mitigate metal whisker formation. A second layer is applied on a top surface of the first layer. The second layer is a conformal coating that includes a second material configured to bind to the top surface of the first layer and fill any microfractures that may form in the first layer. Optionally, a third layer is applied on a top surface of the second layer and includes DLC configured to protect the second layer from oxidation and degradation.

A power relay assembly is provided. A power relay assembly according to an exemplary embodiment of the present invention comprises: a support plate having at least one electric element mounted on one surface thereof and including a plastic material having heat dissipation and insulation properties; and at least one bus bar electrically connected to the electric element and partially embedded in the support plate. Due to these features, since heat generated from the bus bar and the electric element is dissipated to the outside through the support plate, it is possible to prevent performance deterioration due to heat and breakage of electronic components.

A circuit board includes a substrate having an end surface, and a principal surface on which an electronic component is mounted, a first region, provided on the principal surface, and coated with a moistureproof agent, a second region, provided on the principal surface, and prohibited from being coated with the moistureproof agent, and a groove having two ends, formed in the principal surface, between the first region and the second region. The two ends of the groove reach the end surface of the substrate. The groove includes a guiding part, configured to guide the moistureproof agent overflowing from the first region into the groove, provided at a portion of the groove farthest away from the end surface.

The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

[Problem to be solved]

Provided is an electronic component having thermal insulation properties and insulation resistance, which can be suitably used for modularization by injection molding or the like.

[Means to Solve the Problem]

There is provided an electronic component comprising a circuit board on which an electronic element is mounted and a coating layer for coating the surface of the circuit board, wherein the coating layer comprises at least a thermoplastic resin and hollow particles; and the coating layer has a concentration gradient of hollow particles in the thickness direction such that the content of the hollow particles in the coating layer is lower on the face side in contact with the circuit board.