A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a first circuit board having an opening extending through the first circuit board. A Chemical Vapor Deposition Diamond (CVDD) window extends within the opening. A layer of thermally conductive paste extends over the CVDD window. A semiconductor die extends over the layer of thermally conductive paste such that a hot-spot on the semiconductor die overlies the CVDD window.

An electronic or electrical device or component thereof having a coating formed thereon by exposing said electronic or electrical device or component thereof to a plasma comprising one or more monomer compounds for a sufficient period of time to allow a protective polymeric coating to form on a surface thereof; wherein the protective polymeric coating forms a physical barrier over a surface of the electronic or electrical device or component thereof; wherein each monomer is a compound of formula I(a):

##STR00001##

or a compound of formula I(b)

##STR00002##

A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.

The present invention provides an electronic or electrical device or component thereof comprising a cross-linked polymeric coating on a surface of the electronic or electrical device or component thereof; wherein the cross-linked polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising a monomer compound and a crosslinking reagent for a period of time sufficient to allow formation of the cross-linked polymeric coating on a surface thereof,

wherein the monomer compound has the following formula:

##STR00001##

where R.sub.1, R.sub.2 and R.sub.4 are each independently selected from hydrogen, optionally substituted branched or straight chain C.sub.1-C.sub.6 alkyl or halo alkyl or aryl optionally substituted by halo, and R.sub.3 is selected from:

##STR00002##

where each X is independently selected from hydrogen, a halogen, optionally substituted branched or straight chain C.sub.1-C.sub.6 alkyl, halo alkyl or aryl optionally substituted by halo; and n.sub.1 is an integer from 1 to 27; and wherein the crosslinking reagent comprises two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500° C.

A functional vehicle component and related methods include a functional leather assembly fixed over a vehicle component. The functional leather assembly includes a leather sheet, a flexible electronic circuit arranged on a first surface of the leather sheet that faces away from the vehicle component to thereby define an outermost surface of the leather sheet, and including a receiver coil inductively coupled to a transmitter coil on the vehicle component for wirelessly transferring power to the functional leather assembly. Power from a vehicle power source can be wirelessly transferred between the transmitter coil and the receiver coil to power electronic elements of the electronic circuit.

To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 μm, the volume-based cumulative 90% diameter of the resin powder is at most 8 μm, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

A display device includes a display panel including a display surface and a rear surface opposite to each other; and a flexible printed circuit board attachable to the display panel at the rear surface of the display panel. The flexible printed circuit board includes a conductive layer, a passivation layer defining an outer surface of the flexible printed circuit board, and a base film between the conductive layer and the passivation layer, the outer surface includes a first region at which the rear surface of the display panel is attachable to the flexible printed circuit board and a second region at which the rear surface of the display panel is not attached to the flexible printed circuit board, and the first region has greater surface roughness than the second region.

Flexible lighting apparatus and method of manufacturing the same disclosed. The flexible light apparatus includes a net-structured flexible printed circuit board (FPCB), being manufactured in shape of net structure in which a plurality of through-holes are formed separately from each other in a body of the net-structured FPCB, and having predetermined circuit patterns formed thereon, a plurality of light sources, being mounted on at least one of predetermined mounting location among intersection and branch of the net-structured FPCB, and a supporting layer, having apertures formed thereon and being fixed to support the net-structured FPCB at bottom surface.

A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.