A radio-frequency (RF) module is disclosed to include a packaging substrate configured to receive a plurality of components. The RF module also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material.

A method of forming a passivation layer on a substrate includes providing a substrate in a processing chamber. The substrate includes a metallic surface which is a copper, tin or silver surface, or an alloyed surface of one or more of copper, tin or silver. The method further includes depositing at least one organic layer onto the metallic surface by vapour deposition, the organic layer formed from an organic precursor. The organic precursor includes a first functional group including at least one of oxygen, nitrogen, phosphorus, sulphur, selenium, tellurium, or silicon, and a second functional group selected from hydroxyl (OH) or carboxyl (COOH). The first functional group is adsorbed onto the metallic surface. The method further includes depositing at least one inorganic layer onto the organic layer by vapour deposition, wherein the second functional group acts as an attachment site for the inorganic layer.

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 m or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.

A rigid-flex circuit board includes a core substrate, a first outer conductive circuit layer, and a second outer conductive circuit layer. The core substrate includes a first base layer and a second base layer. A first conductive circuit layer is formed on a surface of the first base layer, and a second conductive circuit layer is formed on a surface of the second base layer. An insulating layer is located between the first base layer and the second base layer. The first conductive circuit layer and the second conductive circuit layer are embedded within the insulating layer. A portion of the core substrate located within the first opening and the second opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening and the second opening are defined as a hard board section.

The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.

Aspects of the embodiments are directed to an edge card assembled using surface mount technology (SMT). The edge card can be assembled by providing a printed circuit board comprising a first set of SMT pads proximate an edge of the printed circuit board to receive metal contact fingers and a second set of SMT pads to receive SMT components; placing a metal contact finger onto each of the first set of SMT pads; placing one or more SMT components onto at least some of the second set of SMT pads; providing a solder paste to the printed circuit board; and heating the printed circuit board to reflow the solder paste to mechanically and electrically connect the SMT components and the metal contact finger to the printed circuit board. The edge card can include a thin printed circuit board substrate.

The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

A printed circuit board assembly (1) is provided that comprises a stacked or folded printed circuit board populated by components (2, 3), wherein printed circuit board regions (10, 11, 12) lying opposite one another are electrically connected to one another at least one edge, and wherein the printed circuit board and the components (2, 3) are encased in an encapsulation (4), and wherein at least one separating element (5) is located inside the encapsulation and between each pair of opposing and electrically connected printed circuit board regions (10, 11, 12).