A part comprising a body and a film bonded to a surface of the body and incorporating an electronic circuit. This electronic circuit comprises at least one electronic component, conductive lines connected to the electronic component and at least two connection terminals positioned on at least one of the conductive lines, each connection terminal having a cross-section, in a plane parallel to the surface of the body, greater than twice the cross-section of a conductive line. By virtue of the connection terminals, which are distributed over the electronic circuit, it is possible to replace a faulty circuit segment with a repair circuit segment.

A process method for laser removal of substrate solder mask by: providing a substrate with solder pads; covering the substrate and the solder pads with a solder mask, where the part of the solder mask facing the substrate is the shielding part and the part of the solder mask facing the solder pads is the clearing part; using a camera module to read the QR-code for plate production part number on the substrate; automatically importing the CAD/CAM data to the laser device, where the CAD/CAM data corresponds to the plate production part number; sequentially stripping the cleaning part through the laser beam according to the CAD/CAM data to make the solder mask form a hollow portion; taking a picture of the substrate and taking out the processed substrate picture; completing the substrate processing job if the processed substrate picture and the CAD/CAM data are the same.

The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.

In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.

The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

Provided is a method for manufacturing a display device. The method includes forming a display unit including a bending area on a first surface of a mother substrate, aligning a mask in which a mask opening is defined on a second surface of the mother substrate, plasma treating the second surface of the mother substrate, removing the mask and attaching a protective film to the second surface of the mother substrate, and removing a portion of the protective film to form a film opening corresponding to the bending area. The mask opening corresponds to the bending area.

The invention provides transient devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus. Materials, modeling tools, manufacturing approaches, device designs and system level embodiments of transient electronics are provided.

A component embedded package carrier includes a core layer, at least one electronic component, a first insulating layer, a second insulating layer, a third patterned conductive layer, a fourth patterned conductive layer, a plurality of conductive blind via structures, a first protecting layer and a second protecting layer. The electronic component is disposed inside an opening of the core layer. The first and second insulating layers completely fill the opening and completely encapsulate the electronic component. The conductive blind via structures connect the third and fourth patterned conductive layers with a plurality of conductive through hole structures of the core layer, and connect the third and fourth patterned conductive layers with the electronic component. The first protecting layer covers the third patterned conductive layer and has a first roughness surface. The second protecting layer covers the fourth patterned conductive layer and has a second roughness surface.

A method for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board.

The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.