Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

Electrical components may be mounted on a printed circuit or other substrate. The electrical components may be covered with a conformal coating containing a wavelength-tuned-light-absorption-enhancement additive. The additive may be a dye or other additive that creates a light absorption peak at a given wavelength. To form openings in the conformal coating in alignment with the electrical components without damaging the components, a laser ablation tool may apply laser light at the given wavelength to the conformal coating. Openings may also be formed by placing tape over the components before the con form at coating is applied. The tape may have a color with a light absorption peak at the given wavelength to facilitate the formation of openings without damaging sensitive components.

A release agent for a circuit board resin film being able to release a resin film formed on a circuit board in a short amount of time, having a high resin film fragmentation performance, and having a low environmental burden, is provided. The release agent contains a compound (component (A)) shown in formula (1) and a fatty alcohol (component (B)) having a carbon number of 1-6 and a molecular weight of 30-120, wherein the pH is 13.0-14.0, the content of component (A) is 0.1-5 mass %, and the content of component (B) is 5-40 mass %. Formula (1): R.sup.1O-(A.sup.1O)a-H, wherein R.sup.1 represents a branched alkyl group having a carbon number of 6-10, A.sup.1O represents an oxyalkylene group having a carbon number of 2-3, and a, which is the average number of added moles of the oxyalkylene group, is from 2 to 15.

The present invention provides an electronic device which includes an electromagnetic shield, can keep down a production cost, can be made to have a reduced thickness, and has a high degree of freedom in designing a wiring circuit. Further, the present invention provides a method for producing such an electronic device. The electronic device (1A) includes at least one high frequency functional component (21), an electrically conductive member (10) which electromagnetically shields the at least one high frequency functional component (21), and a resin molded body (23) in which at least part of the high frequency functional component (21) and at least part of the electrically conductive member (10) are embedded and fixed.

A lighted accessory for a motor vehicle includes a machined aluminum body. The body includes a front wall that has a plurality of openings through it and a cavity behind it. A plurality of lenses are potted in place within the openings. LED lights are installed on the aluminum body in alignment with the lenses. Additional potting compound is applied to cover the LEDs and substantially fill the cavity. A faulty LED board may be replaced by removing a portion of the potting compound and the faulty LED board, replacing the faulty LED board with an operable one, and refilling the removed portion of the potting compound with additional potting compound.

A lighted accessory for a motor vehicle includes a machined aluminum body. The body includes a front wall that has a plurality of openings through it and a cavity behind it. A plurality of lenses are potted in place within the openings. LED lights are installed on the aluminum body in alignment with the lenses. Additional potting compound is applied to cover the LEDs and substantially fill the cavity. A faulty LED board may be replaced by removing a portion of the potting compound and the faulty LED board, replacing the faulty LED board with an operable one, and refilling the removed portion of the potting compound with additional potting compound.

Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a method for fabricating a radio-frequency module includes providing a packaging substrate, the packaging substrate configured to receive a plurality of components and the packaging substrate including a ground plane. In some embodiments, the method includes mounting a surface mount device on the packaging substrate, and forming or providing a conductive layer over the surface mount device such that the surface mount device electrically connects the conductive layer with the ground plane to thereby provide radio-frequency shielding between first and second regions about the surface mount device.

A method and apparatus for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board.

Methods for integrating copper-graphene laminate (CGL) in a multilayer PCB fabrication process and the resulting lamination stacks are disclosed. The methods include providing a core and applying a first graphene layer to the surface of the core. The methods further include applying a metal layer to the first graphene layer and applying a second graphene layer to the metal layer. Further, the methods include applying a photoresist layer to the second graphene layer and applying a protective layer to the photoresist layer. In some embodiments, the methods include applying a metallic plating to lamination stack. The methods further include drilling through the protective layer and at least one of a photoresist layer, the second graphene layer, the metal layer, the first graphene layer, and/or the core.

A circuit board water-proofing coating composition is provided comprising: at least one passivating agent, preferably containing a molecule comprising a thio-functional group, desirably a thiol group, an azolic moiety, or an azole, and combinations thereof; at least one binder component comprising an organic or inorganic film-forming polymer, and/or one or more polymer pre-cursors polymerizable on a substrate surface; and optionally one or more additive(s); also provided are methods of making and using the coating composition and coated circuit boards.