An electrical apparatus includes an electrical connector having a plurality of terminals and a connector housing retaining the terminals, a case containing the electrical connector, a circuit board electrically connected with the terminals, and an entrapping structure corresponding to at least a portion of a gap between the connector housing and the case. The entrapping structure has a dead end with an opening facing the gap.

Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

A semiconductor module includes: a circuit board on which a first semiconductor chip and a second semiconductor chip are mounted and includes a first through hole formed with a conductor foil therein; a press-fit terminal that is electrically connected to the conductor foil in the first through hole of the circuit board; and a second resin that is disposed on a surface side and a back surface side of the circuit board. Further, the press-fit terminal is provided with a pressure contact portion which is press-fitted into the first through hole and is electrically connected to the conductor foil in the first through hole, and the second resin on the surface side of the circuit board and the second resin on the back surface side of the circuit board are integrally formed via a second resin that is filled in the first through hole.

A compliant pin system includes a pin having a compliant section including a first leg and an opposing second leg. A first plurality of contact members extend along the first leg. A second plurality of contact members extend along the second leg. A pin validation system is operatively connected to the first plurality of contact members and the second plurality of contact members. The pin validation system detects a presence of an electrical signal passing between corresponding pairs of the first plurality of contact members and the second plurality of contact members to determine an integrity of the compliant pin.

Implementations of semiconductor packages may include: one or more die electrically coupled to a lead frame. The lead frame may be included within a housing. The semiconductor package may also include a set of signal leads extending from the housing, a set of power leads extending from the housing, and a plurality of press fit pins each fixedly coupled to the set of signal leads and the set of power leads. The set of signal leads and the set of power leads may be configured to couple with a substrate.

A printed circuit board including at least one blind metal-plated hole, for receiving a pin of the printed circuit board being covered by a first layer of a protective film on which there extends a second layer of electrically insulating flexible material, the first layer and second layer are for piercing by the pins when they are engaged in the metal-plated holes, the first and second layers being for claming between a support of the pins and the printed circuit board. An electronic unit including such a device. A method of fabricating a printed circuit card for such a device.

An electrical contact includes a compliant tail defining a pair of opposite first main face and second main face, and a pair of opposite first side face and second side face linked between the first main face and the second main face. The opposite first side face and second side face are bulged for engagement with an interior surface of the corresponding through hole. A pair of first through holes and a pair of second through holes extend through both the first main face and the second main face. The first through holes are configured with an elongated configuration while the second though holes are located around two opposite upper and lower ends of the first through holes.

The present application relates to pulsed discharge ionization detectors (PDIDs) and non-radioactive ionization sources, including miniaturized forms thereof. In some examples, the PDID includes annular electrodes, where each electrode is disposed between annular insulators. Also provided herein are methods of making and using such PDIDs, such as for detecting one or more volatile organic compounds, as well as non-radioactive ionization sources.

A device for measuring current intensities including a resistor arrangement, the resistor arrangement having at least two connection elements, at least one resistor element arranged between the connection elements, and at least one contact pin monolithically connected to one of the connection elements and being formed out of the material of the connection element. The device also includes a printed circuit board mechanically and electrically connected to the resistor arrangement, which printed circuit board has a side facing away from the resistor arrangement. The printed circuit board also includes at least one conductor track and at least one passage bore. The at least one contact pin of the resistor arrangement extends through the passage bore and has, on the side of the printed circuit board facing away from the resistor arrangement, a lateral widening. The lateral widening mechanically fixes the printed circuit board to the resistor arrangement.

In a control unit including a press-fit terminal, a substrate includes: a connected portion into which the press-fit terminal is connected; and a guide member, which surrounds a periphery of the connected portion and extends from the substrate. The press-fit terminal includes: a connecting portion formed on a tip end side of the press-fit terminal; and an enlarged portion formed adjacent to the connecting portion. The guide member includes: an opening portion, which opens in a direction in which the press-fit terminal is positioned; a guide hole extending from the opening portion to the substrate; and a reduced-hole portion formed adjacent to the opening portion. The guide hole is configured such that, when the connecting portion of the press-fit terminal is connected to the connected portion of the substrate, the enlarged portion of the press-fit terminal closes the reduced-hole portion of the guide hole.