An electronic device according to various embodiments of the present invention comprises: a housing including a first plate facing in a first direction, a second plate facing in a second direction, and a side part surrounding a space between the first plate and the second plate; a display exposed through the first plate; a wireless communication circuit; and a processor, wherein the second plate includes: a first metal member and a second metal member, wherein the first metal member further includes a first side part facing a portion of the non-metallic extension part, and the second metal member further includes a second side part facing the first side part or another portion of the non-metallic extension part, and wherein the second plate includes an oxidized layer. The electronic device described above and the method for fabricating a housing of the electronic device may be diversified according to embodiments.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.

In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.

A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

Described herein are connector components for selectively connecting to a PCB or other type of secondary device. Such a connector component comprises a body, electrically conductive contact pins, and latching pins. The body includes opposing sides at which are located pinch tabs. The electrically conductive contact pins and the latching pins each includes a portion thereof also extending from the bottom of the body. The pinch tabs are configured to normally bias the latching pins in a first position where the latching pins are angled relative to a central axis of the connector component when the pinch tabs are not being pinched inwards towards one another. Additionally, the pinch tabs are configured to bias the latching pins in a second position where the latching pins are substantially parallel to the central axis of the connector component when the pinch tabs are being pinched inward towards one another.

3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.

An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.

This disclosure provides systems, methods, and apparatus related to printed circuit boards. In one aspect, a device includes a first board and a second board. The first board includes at least two pins defined at an end of the first board. The first pin and the second pin are positioned along a first line and parallel to the first line. The second board includes at least two slots defined at an end of the second board. The first slot and the second slot are positioned along a second line and are angled from the second line by about ±10° to 15° . Each of the pins in the first board is engaged with each of the slots in the second board and forms an electrical connection between the first pin and the first slot and the second pin and the second slot.

Described herein are connector components for selectively connecting to a PCB or other type of secondary device. Such a connector component comprises a body, electrically conductive contact pins, and latching pins. The body includes opposing sides at which are located pinch tabs. The electrically conductive contact pins and the latching pins each includes a portion thereof also extending from the bottom of the body. The pinch tabs are configured to normally bias the latching pins in a first position where the latching pins are angled relative to a central axis of the connector component when the pinch tabs are not being pinched inwards towards one another. Additionally, the pinch tabs are configured to bias the latching pins in a second position where the latching pins are substantially parallel to the central axis of the connector component when the pinch tabs are being pinched inward towards one another.

Connector devices or connectors for use in interconnection to a circuit board may be configured in an open or closed configuration. The connectors devices may utilize a shape memory alloy (SMA) actuator to move clamping portions with respect to each other into one or both of the open or closed positions.