A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

In general, the present invention relates to electrically conducting, polymer coated wires that are in electric contact with, as well as touching, electrically conducting substrates. In particular, the present invention relates to a connection unit for achieving the aforementioned electric connection and touching, as well as a method for producing said connection unit. The present invention also relates to a use for such a connection unit.

A silicon carbide die package with multiple wire access points utilizing top and bottom enclosure plate clamps housing a silicon carbide die on a printed wiring board with wire contact pads, and a set of set screws providing downward pressure from the top enclosure plate inside the center of a cylindrical isolation housing to an isolation ball positioned above a clamp discs to clamp a wire end between the clamp disc and the wire contact pad.

A display device includes a film align pad disposed under a connection film connected to a display panel and including a base lead and an align lead. The base lead extends in a first direction and the align lead protrudes from the base lead in a second direction intersecting the first direction. A board align pad is disposed on a printed circuit board, is connected to the connection film, and includes a base land and an align land. The base land extends in the first direction and the align land protrudes from the base land in the second direction.

Disclosed is a lamp with easy assembly and disassembly comprising a power socket and a lamp body. The power socket comprises a housing and a power supply assembly which is provided in the housing, the power supply assembly is connected with a power supply, the housing is provided with at least one mounting slot which is provided with a press-type locking socket and PCB probes, and the PCB probes are electrically connected with the power supply assembly, a mounting plug with an accommodating groove is provided on the lamp body, a press-type locking plug and a PCB board are provided in the mounting plug; the PCB board is electrically connected to the light source of the lamp body; when the mounting plug is inserted into the mounting slot, the push-type locking plug is inserted into the push-type locking socket and is locked.

A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.

An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

The invention describes a method of manufacturing an LED carrier assembly, which method comprises the steps of providing a carrier comprising a mounting surface with mounting pads arranged to receive a number of LED dies; embedding an alignment magnet in the carrier; providing a number of LED dies, wherein an LED die comprises a number of magnetic die pads; and aligning the magnetic die pads to the mounting pads by arranging the LED dies over the mounting surface of the carrier within magnetic range of the alignment magnet. The invention also describes an LED carrier assembly.

To provide a connected structure of a substrate and an electric wire with high connection reliability even when a carbon nanotube wire with an average diameter of 0.05 mm to 3.00 mm is used as the electric wire. The connected structure of the substrate and the carbon nanotube wire includes a substrate; a carbon nanotube wire made of one or more carbon nanotube aggregates each including a plurality of carbon nanotubes, the carbon nanotube wire having an average diameter of 0.05 mm to 3.00 mm; a conductive fixing member, part of which is provided between the substrate and the carbon nanotube wire; and a conductive member that electrically connects the carbon nanotube wire and the fixing member.

Embodiments of the present disclosure provide an apparatus comprising a printed circuit board (PCB) with a connector to electrically connect the PCB with another apparatus. In embodiments, the apparatus may include a PCB having a via that begins on a first surface of the PCB and ends inside the PCB. The apparatus may further include a connector to electrically connect the PCB with another apparatus or another portion of the apparatus. The connector may include a pin to provide connectivity between the PCB and the connector. The pin may be inserted into the via in response to an attachment of the connector to the PCB. The PCB may include a space that extends from an end of the via inside the PCB to a second surface of the PCB opposite the first surface, to accommodate layers for signal routing inside the PCB. Other embodiments may be described and/or claimed.