A system and method for coupling is described. The system includes, a printed electronic circuit having one or more conductive traces disposed on a flexible substrate The printed electronic circuit includes one or more magnetic couplers disposed on the flexible substrate. The system includes a magnetic connector having one or more magnets that each magnetically attach to a corresponding one of the one or more magnetic couplers The magnetic connector includes one or more spring-loaded pins each aligned with and electrically coupled to a corresponding one of the one or more conductive traces.

A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.

An interposer includes a housing having a plurality of through-holes penetrating a first surface and a second surface and a signal contact pair composed of a pair of signal contacts. Each of the signal contacts includes a base portion press-fitted in one of the through-holes, a first contact beam extending from the base portion beyond the first surface, and a second contact beam extending from the base portion beyond the second surface. The pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction. A first minimum spacing between the first contact beams of the pair of signal contacts is narrower than a second minimum spacing between the base portions of the pair of signal contacts. The signal contact pair has a plane-symmetrical shape with respect to the width direction.

An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.

Glucose monitoring devices and related systems and methods, the glucose monitoring devices including a sensor electronics unit having a housing and a printed circuit board disposed within the housing, a transcutaneous glucose sensor assembly, and a conductive sensor connector. The printed circuit board includes a first electrical contact, the transcutaneous glucose sensor assembly includes a distal portion having a working electrode and proximal portion having a working-electrode contact in electrical communication with the working electrode, and the conductive sensor connector electrically connects the working-electrode contact with the first electrical contact. Further, the conductive sensor connector extends through a hole in the proximal portion of the transcutaneous glucose sensor assembly and through a hole in the printed circuit board.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.

Example human-machine interface (HMI) assemblies are disclosed. An example human-machine interface assembly can include a fascia. The human-machine interface assembly can further include a printed circuit board (PCB). The printed circuit board can have a light emitting diode (LED) to emit light through the fascia. The human-machine interface assembly can further include a backer that can be attached to the fascia.

An electronic switch for the upgrade of an electric stringed instrument for enhancing the musical or artistic performance of a user. The electronic switch has two parts. The first part consisting of a printed circuit board with terminals for wire connections. On the printed circuit board are solid state relays and other electronic components. They are electronically controlled by the second part that is an external user-controlled switch. The switch is an LED touch capacitance switch, also referred as but not limited to, a capacitance touch switch, or touch key. The capacitance touch switch has an LED light that changes colors from either a blue or green to red, but not limited to, indicating when the electronic switch is activated. When the LED touch capacitance switch activates the electronic switch board, the electronic switch board reroutes multiple signals that are attached to its terminal connectors. The electronic switch allows the user to route multiple signals at once with one touch of the LED touch capacitance switch. The LED touch capacitance switch consisting of an LED light that changes colors from either a blue or green to red, but not limited to, when touched allows the user to know the status of the electronic switch. Both parts of the electronic switch obtain power from some type of battery or super capacitor power source, but not limited to.

Example human-machine interface (HMI) assemblies are disclosed. One example HMI assembly includes a fascia, a touch film having a first raised contact, a PCB having a second raised contact, and a piercing member passing through the first and second contacts to electrically couple the first and second contacts.

A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height greater than the one or more pressfit pins.