Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.

The present invention is directed to provide novel composite copper components. For example, provided is a composite copper component including a copper oxide-containing layer formed on at least a portion of the surface of a copper component, in which when the surface of the composite copper component is bonded to a resin substrate by thermocompression, and the copper component is peeled off from the resin substrate after the thermocompression bonding, metal contained in the copper oxide-containing layer is transferred to the resin substrate.

The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.

Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 g/dm.sup.2; a method for producing the copper-clad laminate; and a printed wiring board and a semiconductor package using the copper-clad laminate.

A method for manufacturing a flexible printed circuit board (FPCB) may include a cutting step of cutting a base film including an insulation layer and a copper layer into a panel shape to a predetermined standard, a drilling step of processing a hole passing through all of the insulation layer and the copper layer of the base film, a copper plating step of plating an inner wall of the hole, a circuit and reference mark forming step of forming a predetermined circuit pattern and a reference mark on the copper layer of the base film, a temporary bonding step of temporarily bonding a coverlay to a predetermined area of a top surface of the copper layer on which the circuit and the reference mark are formed, and a complete bonding step of completely bonding the temporarily bonded coverlay to the base film by applying high temperature and high pressure.

A carrier-attached ultra-thin copper foil and a method for manufacturing the same are provided. The method includes modifying a polymer substrate with an amine-based polymer compound to form a modification layer on at least one surface of the polymer substrate. A palladium catalyst is then used to activate the modification layer, thereby forming an activation layer on the modification layer. Subsequently, an ultra-thin copper foil is formed on the activation layer, in which the polymer substrate can be separated from the ultra-thin copper foil via the modification layer and the activation layer.

Disclosed is a manufacturing method of a copper foil composite structure, including providing a carrier; performing a co-plating process through a copper plating solution and a nitrogen-containing compound to form a copper-nitrogen composite layer on the carrier; and forming a copper foil layer on the copper-nitrogen composite layer. A copper foil composite structure is also disclosed.

Provided is a roughened copper foil capable of achieving both excellent transmission characteristics and high peel strength when used for a copper-clad laminate or a printed wiring board. This roughened copper foil includes a roughened surface on at least one side. The roughened surface has a roughness slope tan of 0.58 or less as calculated based on a mean height Rc (m) and a mean width RSm (m) of profile elements by formula Rc/(0.5RSm), and a small projected area RcRSm of 0.45 m.sup.2 or more and 2.00 m.sup.2 or less that is a product of the mean height Rc (m) and the mean width RSm (m) of the profile elements. Rc and RSm are values measured in accordance with JIS B0601-2013 under a condition of not performing a cutoff by a cutoff value s and a cutoff value c.

A component carrier includes a stack with at least one electrically conductive layer structure, at least one electrically insulating layer structure, a cavity delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure, and a component embedded in the cavity and arranged on the stepped metal structure. A bottom side of the stepped metal structure has a flat surface extending continuously along at least one horizontal direction.

Disclosed is a surface-treated copper foil having long-term high-temperature reliability and being suitable for use in high-frequency circuits due to a low transmission loss, wherein the surface-treated copper foil has a surface treatment layer, the surface treatment layer including: a primary particle layer containing Cu or Cu alloy particles formed on at least one surface of an original copper foil; and a secondary particle layer containing Zn particles formed on the primary particle layer, the secondary particle layer being composed of particle clusters formed by clustering of a plurality of Zn particles.