A battery bridge for an electronic device, preferably for an electronic implant, has an electrically conductive first contact element, an electrically conductive second contact element and an insulator. The first contact element and the second contact element comprise a weldable material. In a first state of the battery bridge, the first contact element is distanced from the second contact element via a predefined air gap and the first contact element is electrically insulated from the second contact element by the air gap and the insulator. The battery bridge is formed in such a way that it can be transferred, by welding the first contact element and the second contact element together, into a second state, in which the air gap between the first contact element and the second contact element is closed electrically conductively, at least in part. A method for activating such an electronic device is also disclosed.

A power resistor is disclosed, having at least one electrical connection, having a carrier substrate, which has at least one resistor element composed of a thick-film material and at least one contact electrode to which the resistor element electrically connects, having at least one electrical conductor, which is soldered to the contact electrode and produces an electrical connection between the contact electrode and the electrical terminal, and having a housing, which is at least partially filled with at least one casting compound and in which the resistor element and contact electrode are encapsulated, with the electrical conductor protruding out through the casting compound. In order to achieve a simply designed and easy-to-use power resistor, it is proposed for a pin, in particular a soldering pin or press-fitting pin, to constitute the electrical conductor, which pin is placed onto the contact electrode and soldered to it and constitutes the electrical terminal of the power resistor.

Disclosed is an elastic electrical contact terminal capable of implementing a reliable electrical connection between objects. The electrical contact terminal comprises: an elastic core; a silicone rubber adhesive applied to the outer surface of the elastic core; and an electrically conductive fiber wrapped around and bonded to the elastic core by means of being interposed with the silicone rubber adhesive, wherein a sheet has a polymer coating layer formed on the inner surface thereof facing the silicone rubber adhesive, and has a metal layer formed on the outer surface thereof.

Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

A wiring board includes a substrate, a surface protection film laminated on the substrate and having an opening portion, and a conductor block embedded in the substrate and having a pad portion exposed by the opening portion of the surface protection film. The conductor block has an annular groove formed such that the annular groove is surrounding the pad portion of the conductor block, and the surface protection film is formed such that a portion of the surface protection film is extending into the annular groove.

A circuit board structure includes a body, multiple first pads, a conductive assembly, multiple first engaging components, and multiple second engaging components. The body includes a first portion and a second portion integrally formed. A first surface of the first portion directly contacts a second surface of the second portion. A first region of the first surface protrudes from the second portion, and a second region of the second surface protrudes from the first portion. The first pads and the first engaging components are disposed on the first portion of the body and located in the first region of the first surface. The conductive assembly and the second engaging components are disposed on the second portion of the body and located in the second region of the second portion. The first pads are located between the first engaging components, and the conductive assembly is located between the second engaging components.

A voltage regulator module includes a circuit board assembly, a magnetic core assembly and a molding compound layer. The circuit board assembly includes a printed circuit board and at least one switch element. The switch element is disposed on a first surface of the printed circuit board. Moreover, at least one first copper post, at least one second copper post, at least one third copper post and the magnetic core assembly are disposed on a second surface of the printed circuit board. The magnetic core assembly includes at least one opening. The at least one first copper post is penetrated through the corresponding opening, so that at least one inductor is defined by the at least one first copper post and the magnetic core assembly collaboratively. The molding compound layer encapsulates the printed circuit board and the magnetic core assembly in a double-sided molding manner.

A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

A stacked circuit card assembly includes a power supply having a positive terminal and a negative terminal, a first circuit card having a first via electrically connected to the positive terminal and a second via electrically connected to the negative terminal, and a second circuit card having a third via aligned with the first via and a fourth via aligned with the second via. The assembly further includes a first conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card, and a second conductive stand-off disposed between the first circuit card and the second circuit card and structurally supporting the first circuit card with respect to the second circuit card. The first conductive stand-off provides a conductive pathway between the first via and the third via, and the second conductive stand-off provides a conductive pathway between the second via and the fourth via.