A multilayer wiring board has a high degree of freedom of wiring design and can realize high-density wiring, and a method to simply manufacture the multilayer wiring board. A core substrate with two or more wiring layers provided thereon through an electrical insulating layer. The core substrate has a plurality of throughholes filled with an electroconductive material, and the front side and back side of the core substrate have been electrically conducted to each other by the electroconductive material. The throughholes have an opening diameter in the range of 10 to 100 m. An insulation layer and an electroconductive material diffusion barrier layer are also provided, and the electroconductive material is filled into the throughholes through the insulation layer. A first wiring layer provided through an electrical insulating layer on the core substrate is connected to the electroconductive material filled into the throughhole through via.

A graphene wiring structure of an embodiment has a substrate, a metal part on the substrate, multilayered graphene connected to the metal part, a first insulative film on the substrate, and a second insulative film on the substrate. The metal part is present between the first insulative film and the second insulative film. Edges of the multilayered graphene are connected to the metal part. A side face of the first insulative film vertical to the substrate opposes a side face of the second insulative film vertical to the substrate. A first outer face of the multilayered graphene is in physical contact with a first side face of the first insulative film vertical to the substrate. A second outer face of the multilayered graphene is in physical contact with a second side face of the second insulative film vertical to the substrate.

A wiring substrate includes a first build-up part including a first conductor layer, a first insulating layer, and first via conductors penetrating through the first insulating layer, a second build-up part including second conductor layers, second insulating layers, and second via conductors penetrating though the second insulating layers, a third build-up part including a third conductor layer, a third insulating layer, and third via conductors penetrating through the third insulating layers such that the second built-up part is formed between the first built-up part and the third build-up part. The first, second and third build-up parts are formed such that a diameter of each of the first via conductors is smaller than a diameter of each of the second via conductors and that the diameter of each of the second via conductors is smaller than a diameter of each of the third via conductors.

The invention provides a printed circuit board and a semiconductor package having the same, the printed circuit board includes traces disposed on respective upper and lower surfaces of the base layers and disposed on different vertical levels from a lowermost layer to an uppermost layer, and through vias connecting traces disposed on different vertical levels to each other and each extending in a vertical direction to pass through at least one of the base layers. The through vias include a first through via connecting the traces at the lowermost layer and the uppermost layer to each other, and a second through via connecting respective traces at adjacent intermediate layers between the lowermost layer and the uppermost layer to each other. The first through via passes through the inside of the second through via in the vertical direction, and the first through via is insulated from the second through via.

A substrate structure includes a substrate and a vertical conductive connector. The substrate includes a material with a heat resistance temperature of 300 C. or greater. The vertical conductive connector penetrates through the substrate. The vertical conductive connector has a bonding structure extending toward the substrate. A manufacturing method of the substrate structure is also provided.

Provided is a glass circuit board and a manufacturing method thereof and an imaging device that achieve higher reliability. A glass circuit board including: a glass substrate serving as a core material including a first side, a second side located opposite from the first side, an outer end face located between the first side and the second side, and a through hole penetrating between the first side and the second side; an insulating first resin layer covering the first side; an insulating second resin layer covering the second side; a third resin layer that covers the inner surface of the through hole and is continuous with the first resin layer and the second resin layer; a fourth resin layer that covers the outer end face and is continuous with the first resin layer and the second resin layer; a first core wiring provided on the first side with the first resin layer interposed between the first core wiring and the first side; a second core wiring provided on the second side with the second resin layer interposed between the second core wiring and the second side; and a feed-through wiring provided on the inner surface of the through hole with the third resin layer interposed between the feed-through wiring and the inner surface.

A disclosed circuit board may include an insulating layer having a via hole penetrating in one direction, a pad disposed on the insulating layer to cover the via hole, and a circuit wiring disposed on the insulating layer. The pad and the circuit wiring may include a first plurality of metal layers and a second plurality of metal layers, respectively, and the number of the first plurality of metal layers of the pad may be greater than that of the second plurality of metal layers of the circuit wiring.

A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming opening through the protective film and insulating layer, removing the film, cleaning the surface of the insulating layer, forming a second conductor layer on the surface of the insulating layer; and forming a via conductor connecting the first and second conductor layers in the opening. The insulating layer includes resin and inorganic particles having spherical shapes, the cleaning includes selectively removing the resin such that the particles include first particles partially embedded and second particles completely embedded in the resin. The forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.

A layered body is manufactured by etching a first foil constituting a three-layer metal foil to form a first metal layer shaped like a pattern, stacking a first insulating layer so as to bury the first metal layer, forming a first via as a plated via, forming a second metal layer shaped like a pattern on the first insulating layer, stacking a second insulating layer so as to bury the second metal layer, removing a second foil and a third foil constituting the three-layer metal foil, stacking a third insulating layer and a resin film on the second insulating layer, and providing a second via as a paste via to the second insulating layer, and a multilayer substrate is obtained by stacking a plurality of layered bodies.

A circuit board and a method of circuit plating thereof are provided. The circuit board includes a substrate, a conductive pillar and a first circuit layer. The substrate includes a first surface, a second surface opposite the first surface, and a hole extending from the first surface toward the second surface. The first circuit layer is disposed on the first surface and is connected to the conductive pillar. The conductive pillar includes N cylindrical metal shells disposed inside the hole and arranged in a concentric pattern, in which a (K-1) cylindrical metal shell surrounds and covers the Kth cylindrical metal shell, and an interface is formed between the (K-1) and the Kth cylindrical metal shells, and the 1st cylindrical metal shell covers and contacts a sidewall of the hole, in which N and K are both positive integers and NK3.