Semiconductor assemblies including thermal layers and associated systems and methods are disclosed herein. In some embodiments, the semiconductor assemblies comprise one or more semiconductor devices over a substrate. The substrate includes a thermal layer configured to transfer thermal energy along a lateral plane and across the substrate. The thermal energy is transferred along a non-lateral direction from the semiconductor device to the graphene layer using one or more thermal connectors.

A method for manufacturing of a hybrid component carrier includes providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer and forming a second layer structure on the first layer structure wherein the second layer structure has at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements. The second density of electrically conductive elements is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.

A manufacturing method of a circuit board includes the following steps. A conductive plate is provided. The conductive plate is patterned to form ducts. The patterned conductive plate is laminated with a core dielectric layer. The lamination leaves exposed a bottom surface of the patterned conductive plate. Through holes are opened in portions of the core dielectric layer within the ducts. A conductive material is formed in the through holes and over the core dielectric layer to produce a metallization layer electrically insulated from the patterned conductive plate. Dielectric layers and conductive layers are alternately stacked on an upper surface of the core dielectric layer. The conductive layers are electrically connected to the metallization layer.

A circuit board structure includes a first core layer, a first build-up layer and a second build-up layer. The first core layer has a first surface and a second surface opposite to the first surface, wherein the first core layer includes a core dielectric material layer and at least one patterned conductive plate embedded within the core dielectric material layer, the core dielectric material layer includes a first sub-dielectric material and a second sub-dielectric material, and at least one interface exists in between the first sub-dielectric material and the second sub-dielectric material. The first build-up layer is disposed on the first surface of the first core layer, and the second build-up layer is disposed on the second surface of the first core layer.

A light emitting diode (LED) module may include a direct current (DC) voltage node formed on a first layer. The DC voltage node may be configured to sink a first current. One or more devices may be formed on the first layer configured to provide a second current to one or more LEDs. A device of the one or more devices may carry a steep slope voltage waveform. A local shielding area may be formed in a second layer directly below the DC voltage node and the one or more devices. The local shielding area may include a substantially continuous area of conductive material. A conductive via may extend through one or more layers. The conductive via may electrically connect the DC voltage node and the local shielding area.

A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other

An intermediate printed board has a plurality of unit regions that are to be cut out and separated to become a plurality of individual printed circuit boards, respectively. The intermediate printed board includes a metal core substrate including: a metal layer; and a plating layer formed on each of a top surface and a bottom surface of the metal layer, the plating layer being absent in each of cutting regions, the cutting regions being regions on the intermediate printed board where the plurality of unit regions are separated so as to produce the plurality of individual printed circuit boards; an insulating layer formed so as to cover a surface of the metal core substrate; and a conductive pattern formed on the insulating layer.

A manufacturing method of a circuit board includes the following steps. A conductive plate is provided. The conductive plate is patterned to form ducts. The patterned conductive plate is laminated with a core dielectric layer. The lamination leaves exposed a bottom surface of the patterned conductive plate. Through holes are opened in portions of the core dielectric layer within the ducts. A conductive material is formed in the through holes and over the core dielectric layer to produce a metallization layer electrically insulated from the patterned conductive plate. Dielectric layers and conductive layers are alternately stacked on an upper surface of the core dielectric layer. The conductive layers are electrically connected to the metallization layer.

The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.

A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.