This invention provides methods for the processing of platinum metallized high temperature co-fired ceramic (HTCC) components with minimum deleterious reactions between platinum and the glass constituents of the ceramic-glass body. The process comprises co-firing a multilayer laminate green ceramic-glass body with via structures filled with a platinum powder-based material in a reducing atmosphere with a specified level of oxygen partial pressure. The oxygen partial pressure should be maintained above a minimum threshold value for a given temperature level.

A multilayer circuit board includes a first connecting wiring board comprising a first bonding layer and a liquid crystal polymer formed on the first bonding layer. The first bonding layer comprises a first insulating filler. A fusion temperature of the first bonding layer is less than a fusion temperature of the liquid crystal polymer. The multilayer circuit board further includes a first wiring board and a second wiring board disposed on opposite sides of the first connecting wiring board. The first wiring board is combined with the first bonding layer. A method for manufacturing such multilayer circuit board is also provided.

A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.

A multilayer resin substrate includes a stacked body including resin layers stacked on each other, a first planar conductor on a resin layer, and an interlayer connection conductor on a resin layer. The interlayer connection conductor includes a first interlayer connection conductor connected to an external conductor, and a second interlayer connection conductor bonded to the first interlayer connection conductor and a planar conductor. The first and second interlayer connection conductors are made of different materials. The second interlayer connection conductor includes a constricted portion including a smaller planar cross-sectional area than a different portion, between a bonding portion to which the first interlayer connection conductor is bonded and a bonding portion to which the planar conductor is bonded.

An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.

A method of manufacturing a component carrier is disclosed. The method includes providing a first component carrier body having at least one first electrically insulating layer structure and at least one first electrically conductive layer structure, providing a second component carrier body having at least one second electrically insulating layer structure and at least one second electrically conductive layer structure, providing at least a part of at least one of the first component carrier body and the second component carrier body of an at least partially uncured material, and interconnecting the first component carrier body with the second component carrier body by curing the at least partially uncured material.

A circuit board including an interconnect substrate and a multilayer structure is provided. The interconnect substrate includes a core layer and a conductive structure disposed on the core layer. The multilayer structure is disposed on the conductive structure. The multilayer structure includes a plurality of dielectric layers and a plurality of circuit structures. The circuit structures are disposed in the dielectric layers. A topmost layer in the circuit structures is exposed to the dielectric layers to be in contact with the conductive structure. A pattern of the topmost layer in the circuit structures and a pattern of a top surface of the conductive structure are engaged with each other.

A multilayer substrate includes a lamination body including a first resin substrate, a second resin substrate, and a bonding layer that are hot-pressed. A first conductor pattern including a surface defined by a plated film is disposed on a first surface of the first resin substrate. A second conductor pattern including a surface defined by a plated film is disposed on a second surface of the first resin substrate. A third conductor pattern including a surface defined by a plated film is disposed on a third surface of the second resin substrate. A fourth conductor pattern including a surface defined by a plated film is disposed on a fourth surface of the second resin substrate. The first conductor pattern is located closer to one outermost layer than the second conductor pattern is. The second conductor pattern is thinner than the first conductor pattern.

An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

A method for manufacturing of a hybrid component carrier includes providing a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer and forming a second layer structure on the first layer structure wherein the second layer structure has at least a first layer and a second layer. The first layer structure has a first density of electrically conductive elements. The second layer structure has a second density of electrically conductive elements. The second density of electrically conductive elements is greater than the first density of electrically conductive elements. The forming of the second layer structure on the first layer structure includes forming the first layer of the second layer structure on the first layer structure and subsequently forming the second layer of the second layer structure on the first layer of the second layer structure.