A multi-phase busbar can include a first conducting layer, a first conducting pin, a first insulating layer, and a second conducting layer. The first conducting layer can include a sheet metal coated with an electrically insulating material. The first conducting pin can be mounted to the first conducting layer. The first conducting pin can extend in a direction perpendicular to the first conducting layer. The first insulating layer of a rigid insulating material can be arranged on the first conducting layer. The first insulating layer can define an opening through which the first conducting pin projects. The second conducting layer can include a sheet metal coated with an electrically insulating material, the second conducting layer comprising a first pinhole through which the first conducting pin projects and a second conducting pin which extends in a direction parallel to the first conducting pin.

A multi-phase busbar for conducting electric energy includes: an insulating base layer made of an insulating material; a first conducting layer made of a sheet metal arranged on and adhesively bonded to the base layer; a first connecting pin mounted to the first conducting layer which extends in a direction with respect to the first conducting layer; a first insulating layer arranged on and adhesively bonded to the first conducting layer; a second conducting layer made of a sheet metal arranged on and adhesively bonded to the first insulating layer, the second conducting layer including a second connecting pin which extends in a direction parallel to the first connecting pin; and a second insulating layer arranged on and adhesively bonded to the second conducting layer. The second conducting layer and the first and second insulating layer each include at least one pinhole through which the first connecting pin projects.

A multi-phase busbar for conducting electric energy includes: a base layer of an insulating material; a first conducting layer of a sheet metal; a first insulating layer of an insulating material arranged on the first conducting layer; a second conducting layer of a sheet metal arranged on the insulating layer; and a second layer of an electrically insulating material which is arranged on the second conducting layer. The first and/or second insulating layers include spacers, each spacer including a layer of a rigid insulating material. At least one of the spacers is glued to an electrically insulating coating of the first and/or second conducting layer, and/or at least one of the spacers is glued to an electrically conductive surface of an uncoated first and/or second conducting layer by an adhesive.

A laminated substrate includes: a first substrate; a second substrate having a through-hole; a third substrate; a first adhesive layer bonding a rear surface of the first substrate and a front surface of the second substrate; a second adhesive layer bonding a rear surface of the second substrate and a front surface of the third substrate; a first post penetrating through the first adhesive layer, electrically connecting the first substrate to the second substrate, and made of an alloy of a high melting point metal and a low melting point metal; a second post penetrating through the second adhesive layer, electrically connecting the second substrate to the third substrate, and made of an alloy of the high melting point metal and the low melting point metal; and an electronic component fixed to the front surface of the third substrate and disposed in the through-hole of the second substrate.

A printed wiring board includes a core substrate and first and second build-up layers. The substrate includes a core layer, through-hole conductors formed in through holes such that each through hole has first opening tapering from first toward second surface of the core layer, and second opening tapering from second toward first surface of the core layer, and first and second through-hole lands directly connected to the through-hole conductors. Each build-up layer includes an insulating layer, via conductors, via lands, an outermost insulating layer, an outermost conductor layer, and outermost via conductors. Each of the through-hole lands, via lands and outermost conductor layers includes a metal foil, a seed layer and an electrolytic plating film. The foils have mat surfaces such that the mat surfaces of the via lands has ten-point average roughness smaller than ten-point average roughness of the mat surfaces of the through-hole lands and outermost conductor layers.

A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer.

A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a metal carrier, a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer and a conductive pillar layer. The first conductive wiring layer is disposed on a surface of the metal carrier. The dielectric material layer is disposed on a surface of the first conductive wiring layer. The conductive pillar layer is disposed inside the dielectric material layer, and located between the first conductive wiring layer and the second conductive wiring layer. The conductive pillar layer has at least one conductive pillar. The conductive pillar is electrically connected to the first conductive wiring layer and the second conductive wiring layer.

A printed wiring board includes a core substrate and first and second build-up layers. The substrate includes a core layer, through-hole conductors formed in through holes such that each through hole has first opening tapering from first toward second surface of the core layer, and second opening tapering from second toward first surface of the core layer, and first and second through-hole lands directly connected to the through-hole conductors. Each build-up layer includes an insulating layer, via conductors, via lands, an outermost insulating layer, an outermost conductor layer, and outermost via conductors. Each of the through-hole lands, via lands and outermost conductor layers includes a metal foil, a seed layer and an electrolytic plating film. The foils have mat surfaces such that the mat surfaces of the via lands has ten-point average roughness smaller than ten-point average roughness of the mat surfaces of the through-hole lands and outermost conductor layers.

A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.

A method of manufacturing a component-embedded substrate includes a resist forming step in which a patterning resist is formed on a support, a patterning step in which a through hole extending through the resist is formed by performing patterning on the resist, a first-electrode forming step in which a through-via electrode is formed by filling the through hole with an electrode material, a resist removing step in which the resist is removed, a component placement step in which an electronic component is placed, a substrate forming step in which a resin substrate is formed by sealing the electronic component with a resin that includes a filler having a diameter larger than the surface roughness of a side surface of the through-via electrode, and a removing step in which the support is removed from the resin substrate. The first-electrode forming step is performed before the substrate forming step is performed.