Provided are a curable composition for imprinting capable of simultaneously obtaining excellent curing properties and excessive reaction inhibiting properties during light irradiation at a low exposure dose, a method of manufacturing a cured product pattern, a method of manufacturing a circuit substrate, and a cured product. The curable composition for imprinting satisfies the following A to C: A: the curable composition comprises a polyfunctional polymerizable compound having a polymerizable group equivalent of 150 or higher; B: the curable composition comprises a photopolymerization initiator; and C: the curable composition satisfies at least one of a condition that a content of an ultraviolet absorber in which a light absorption coefficient at a maximum emission wavelength of an irradiation light source is 1/2 or higher of a light absorption coefficient of the photopolymerization initiator is 0.5 to 8 mass % with respect to non-volatile components or a condition that a content of a polymerization inhibitor is 0.1 to 5 mass % with respect to the non-volatile components. The non-volatile components refer to components in the curable composition for imprinting other than a solvent.

A method for manufacturing a circuit board includes forming a patterned first dielectric layer on a substrate; forming a first adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the first adhesive layer; patterning the second dielectric layer to expose a portion of a top surface of the first adhesive layer opposite to the substrate; and filling at least the patterned second dielectric layer with a conductive material, such that the conductive material is in contact with the top surface of the first adhesive layer.

A component carrier includes a stack with an electrically conductive layer structure and an electrically insulating layer structure. The electrically conductive layer structure having a first plating structure and a pillar. The pillar has a seed layer portion on the first plating structure and a second plating structure on the seed layer portion. A method of manufacturing such a component carrier and an arrangement including such a component carrier are also disclosed.

According to one embodiment, the present invention relates to a printed circuit board, comprising: a first insulating layer; an inner layer circuit pattern disposed on an upper surface of the first insulating layer; a second insulating layer, disposed on the first insulating layer, for covering the inner layer circuit pattern; a first outer layer circuit pattern integrated into a lower surface of the first insulating layer; and a second outer layer circuit pattern embedded in an upper surface of the second insulating layer, the first insulating layer comprising a thermosetting resin, and the second insulating layer comprising a photocurable resin.

A printed circuit board includes: an insulation material including a cavity formed therein; a first electronic element disposed in the cavity and including a groove; and a second electronic element disposed in the groove of the first electronic element.

A method for forming a multilayered circuit pattern on a surface of a 3D metal board includes: forming a first insulation layer on the surface of the 3D metal board; forming a first conductive pattern on the first insulation layer; forming a second insulation layer on the first conductive pattern except for a predetermined region; forming a second conductive pattern on the second insulation layer; and forming a third insulation layer on the second conductive pattern except for one or more circuit element mounting regions.

A method of fabricating an interposer includes: providing a carrier substrate; forming a unit redistribution layer on the carrier substrate, the unit redistribution layer including a conductive via plug and a conductive redistribution line; and removing the carrier substrate from the unit redistribution layer. The formation of the unit redistribution layer includes: forming a first photosensitive pattern layer including a first via hole pattern; forming a second photosensitive pattern layer including a second via hole pattern and a redistribution pattern on the first photosensitive pattern layer; at least partially filling insides of the first via hole pattern, the second via hole pattern, and the redistribution pattern with a conductive material; and performing planarization to make a top surface of the unit redistribution layer flat. According to the method, no undercut occurs under a conductive structure and there are no bubbles between adjacent conductive structures, thus device reliability is enhanced and pattern accuracy is realized.

A plating method of a circuit board includes first to fifth steps. The first step is implemented by providing a substrate, and the substrate has a first board surface and a second board surface opposite to the first board surface. The second step is implemented by forming a thru-hole in the substrate, and the thru-hole penetrates from the first board surface to the second board surface. The third step is implemented by detachably bonding a carrier onto the second board surface of the substrate to cover the thru-hole, and a portion of the carrier covering the thru-hole is defined as a plated region. The fourth step is implemented by plating the plated region of the carrier to form a metal post that is filled fully within the thru-hole. The fifth step is implemented by tearing off the carrier from the substrate and the metal post.

A method for manufacturing a substrate structure is provided. The method includes the following steps. A substrate is provided. The substrate has a patterned first metal layer, a pattern second metal layer and a through hole. After that, a first dielectric layer and a second dielectric layer are formed at a first surface and a second surface of the substrate, respectively. The second surface is opposite to the first surface. Then, the first dielectric layer and the second dielectric layer are patterned. After that, a first trace layer is formed at a surface of the patterned first dielectric layer. The first trace layer is embedded into the patterned first dielectric layer and is coplanar with the first dielectric layer. Then, a second trace layer is formed on a surface of the second dielectric layer.

Methods and systems are contemplated for making portions of electrical circuits with embedded electrical components, and the electrical circuits produced thereby. A layer of dielectric material is deposited over a substrate, and a cavity is formed in the dielectric material. An electrical component (e.g., integrated chip, etc.) is deposited in the cavity and covered by a further dielectric material, embedding the electrical component. Another cavity is formed in the further dielectric material, and a catalyst (e.g., electrolytic deposition catalyst, electroless deposition catalyst, etc.) is deposited over the further dielectric material and at least a portion of the electrical component. A conductor is then plated at the catalyst, preferably contacting the I/O ports of the electrical component.