A cooling device comprises a first casing for direct mounting on a heat-generating component and a second casing mounted on the first casing. One casing includes an internal channel connected to a cold inlet and to a hot outlet allowing a heat-transfer fluid to flow in the internal channel. The other casing includes a storage containing a phase change material (PCM) changing from a solid state to a liquid state to transfer thermal energy from the heat-generating unit to the PCM, the PCM changing from the liquid state to the solid state to transfer thermal energy from the PCM to the heat-transfer fluid. The cooling device may be integrated in a cooling circuit of a cooling system including an external cooling unit, or in a closed loop cooling circuit of a cooling arrangement that transfers heat from the closed loop to an open loop.

An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

A cooling system for at least one thermal unit includes a tank assembly that includes: a sump chamber, a purge chamber that is located above the sump chamber, and a reservoir chamber that is located above the purge chamber; a cooling circuit that includes a pump, a heat exchanger, and conduits, the cooling circuit being configured to circulate a liquid coolant through the at least one thermal unit, the sump chamber, the pump, the heat exchanger, and the reservoir chamber; a first valve located externally of the tank assembly and configured such that, when the first valve is open, (i) the liquid coolant is flowable from the purge chamber to the sump chamber via the first valve, and (ii) air is simultaneously flowable from the sump chamber to the purge chamber via the first valve; and a second valve located externally of the tank assembly and configured such that, when the second valve is open, (i) the liquid coolant is flowable from the reservoir chamber to the purge chamber via the second valve, and (ii) air is simultaneously flowable from the purge chamber to the reservoir chamber via the second valve.

Thermal energy management kits are described herein. A thermal energy management kit described herein includes one or more thermal storage cells. Individual thermal storage cells have a container. The container may be formed from a thermally conductive material and has an interior volume. The thermal storage cell further includes a phase change material disposed within the interior volume of the container. Thermal energy management kits described herein may optionally further include one or more mounting structures.

A system provides cooling to an infrastructure having heat-generating units. Internal cooling units are thermally connected to the heat-generating units. An external cooling unit dissipates thermal energy of a heat-transfer fluid circulating in the internal cooling units. A cooling circuit connects the internal and external cooling units. A pump maintains a flow of the heat-transfer fluid for transferring thermal energy from the heat generating units to the external cooling unit. A reservoir thermally connected to the cooling circuit contains a phase change material (PCM) changing between solid and liquid states according to a temperature of the heat-transfer fluid. Thermal energy is transferred between the cooling circuit and the PCM depending on whether a temperature of the heat-transfer fluid is above or below a phase-change temperature value of the PCM. A supplemental cooling device thermally connected to the reservoir dissipates heat from the reservoir to the atmosphere.

A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (PCM) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.

A data center includes heat producing components and an air handling system that provides reduced relative humidity air to cool the heat producing components. The air handling system includes a thermal storage unit that removes thermal energy from incoming air under a given set of ambient air conditions and releases thermal energy into incoming air under another set of ambient air conditions. Under the given set of ambient air conditions, the thermal storage unit cools the incoming air and causes water vapor to condense out of the incoming air. Under the other set of ambient air conditions, the thermal storage unit releases thermal energy into the incoming air, thus heating the incoming air.

An inverter device includes a radiator that includes a latent heat storage material transitioning between a solid phase region, a phase transition region, and a liquid phase region, in accordance with a temperature of the latent heat storage material, and that absorbs heat generated in switching elements, a temperature sensor that detects the temperature of the latent heat storage material, and a microcomputer. The microcomputer includes a determining unit that determines whether a condition is satisfied, the condition being that the temperature of the latent heat storage material is close to a melting point of the latent heat storage material, and that the temperature of the latent heat storage material is on a rising trend, and a supercooling suppressing unit that limits a motor current when the determining unit determines that the condition is satisfied.

A thermal insulation sheet includes a heat storage sheet, an insulation sheet affixed to the heat storage sheet, and a highly-thermoconductive sheet affixed to the insulation sheet. The heat storage sheet contains a resin and powdery microcapsules mixed with the resin. The powdery microcapsules encapsulate latent-heat storage agent. The heat storage sheet has a void ratio not less than 10% and not more than 30%. Or, the heat storage sheet may have surface roughness Ra not less than 2 m and not more than 20 m. The thermal insulation sheet suppresses or retards transferring of heat generated in a heat-generating component to outside, and suppresses a rapid rising of a temperature of the heat-generating component.

A heat insulation pad applied to an electronic device is provided. The electronic device includes a housing and a heat source. The housing includes an inner side surface. The heat insulation pad includes a first contact layer, a second contact layer, and a hole layer stack structure. The first contact layer is adapted to attach to the inner side surface. The second contact layer is adapted to contact the heat source. The hole layer stack structure includes a plurality of hole layers stacked in sequence and is located between the first contact layer and the second contact layer. An electronic device with the heat insulation pad is further provided.