Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).

A ventilation and air-conditioning system for a room includes a cooling air supply system, a supply air duct system and at least one enclosure. The enclosure includes an inlet, an outlet, and heat storage elements. The ventilation and air-conditioning system is configured such that when the operation of the cooling air supply system fails, a natural convection airflow occurs through the enclosure from the inlet to the outlet, the natural convection airflow being cooled by transferring heat to the heat storage elements. The supply air duct system is arranged above the inlet at a distance from the inlet. A gap is defined between the supply air duct system and the inlet. The inlet of the enclosure is adapted to be in constant flow communication with the room by air flowing from the room through the gap into the inlet of the enclosure.

A housing contains an internal volume. A heat-sensitive device is contained by the housing and consumes a device percentage of the internal volume. The device percentage equals the percentage of the internal volume of the housing consumed by the heat-sensitive device. A phase-change material is positioned within the housing to conduct heat from the heat-sensitive device. The phase-change material consumes a percentage of the internal volume equal to 100 percent minus the device percentage minus an expansion percentage. The phase-change material expands in volume by an amount more than 75 percent of the expansion percentage upon occurrence of a phase-change event.

A power conversion module, such as a power adapter, includes a heat removal system such as an active heat removal system, a passive heat removal system or a hybrid heat removal system. A small-size power conversion module having a heat removal system is described.

Systems associated with device temperature adjustment are described. A device temperature adjustment system can include an electronic device having a temperature sensor integrated therein to detect a temperature of the electronic device and a temperature adjust module coupled to the electronic device to adjust a temperature of the electronic device based on the detected temperature.

A power conversion module, such as a power adapter, includes a heat removal system such as an active heat removal system, a passive heat removal system or a hybrid heat removal system. A small-size power conversion module having a heat removal system is described.

A data center includes heat producing components and an air handling system that provides reduced relative humidity air to cool the heat producing components. The air handling system includes a thermal storage unit that removes thermal energy from incoming air under a given set of ambient air conditions and releases thermal energy into incoming air under another set of ambient air conditions. Under the given set of ambient air conditions, the thermal storage unit cools the incoming air and causes water vapor to condense out of the incoming air. Under the other set of ambient air conditions, the thermal storage unit releases thermal energy into the incoming air, thus heating the incoming air.

A data center includes heat producing components and an air handling system that provides reduced relative humidity air to cool the heat producing components. The air handling system includes a thermal storage unit that removes thermal energy from incoming air under a given set of ambient air conditions and releases thermal energy into incoming air under another set of ambient air conditions. Under the given set of ambient air conditions, the thermal storage unit cools the incoming air and causes water vapor to condense out of the incoming air. Under the other set of ambient air conditions, the thermal storage unit releases thermal energy into the incoming air, thus heating the incoming air.

A data center includes an air handling system and a thermal energy receptacle system. The air handling system moves air across heat producing components of electrical systems in the data center. The thermal energy receptacle system is coupled to the air handling system. The thermal energy receptacle system includes one or more heat exchangers that exchange heat between air moving through the air handling system and a fluid, one or more phase change material modules including phase change material, and a fluid transport system that transports fluid between the phase change material modules and the heat exchangers. The thermal energy receptacle system transfers heat from air passing over the one or more heat exchangers to at least one of the phase change material modules such that at least a portion of the phase change material changes phase.

Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).