A pluggable module includes an outer housing having a cavity between an upper wall and a lower wall. A circuit card is received in the cavity having a card edge configured to be received in a card slot of a communication connector. A circuit card holder engages the circuit card and holds the circuit card in the cavity of the outer housing. The circuit card holder includes a locating fin at a top of the circuit card holder. The locating fin has a sacrificial upper edge configured to engage the outer housing to locate the circuit card holder and the circuit card in the cavity. The sacrificial upper edge is deformed when engaging the outer housing to press the circuit card holder and the circuit card in a downward biasing direction.

A connector assembly for mounting a chip module to a printed circuit board (PCB) includes: a seating mechanism including a socket connector, a metallic seat frame, and a metallic load plate; a back plate; and plural fasteners extending through the seating mechanism, the PCB, and the back plate to fasten the seating mechanism and the back plate on two opposite sides of the PCB, wherein the back plate has a curved inner region and a flat outer region and the fasteners extend through the flat outer region of the back plate.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.

To provide a socket for electrical component that allows an electric component to be pushed down adequately in accordance with the kind of the contact pins or the terminal of the electrical component. An IC socket for electrical component comprising: a socket body 13 accommodating an IC package 11; a cover member 15 for pressing the accommodated IC package 11; and a lever member 17 for pressing the cover member 15. A long hole 23h is provided on the socket body 13 to movably support the cover member 15, a third shaft 33 supported by the long hole 23h is provided on the cover member 15, and the cover member 15 is configured to be closed so that the cover member 15 is pushed down along the long hole 23h.

An IC socket (11) comprises contact pins (14) disposed in the socket body (13) to be disjunctive to terminals of the IC package (12), an opening and closing body (19A,19B) rotatably provided in the socket body (13), the opening and closing body (19A,19B) having a pressing member (23a,23b) for pressing a top surface of the IC package (12) accommodated on an accommodating surface portion (16d) of the socket body (13); and an operating member (20) for opening and closing the opening and closing body (19A,19B) disposed up and down movably with respect to the socket body (13). A first opening and closing body (19A) having a heat sink (23a) for pressing an entire of the top surface of the IC package (12) and a second opening and closing body (19B) having a block (23b) for pressing the heat sink (23a) are disposed at different positions mutually.

A pluggable module includes an outer housing having a cavity between an upper wall and a lower wall. A circuit card is received in the cavity having a card edge configured to be received in a card slot of a communication connector. A circuit card holder engages the circuit card and holds the circuit card in the cavity of the outer housing. The circuit card holder includes a locating fin at a top of the circuit card holder. The locating fin has a sacrificial upper edge configured to engage the outer housing to locate the circuit card holder and the circuit card in the cavity. The sacrificial upper edge is deformed when engaging the outer housing to press the circuit card holder and the circuit card in a downward biasing direction.

The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

Apparatuses, systems and methods associated with connector design for mating with integrated circuit packages are disclosed herein. In embodiments, a connector for mating with an integrated circuit (IC) package may include a housing with a recess to receive a portion of the IC package and a contact coupled to the housing and that extends into the recess. The contact may include a main body that extends from the housing into the recess and a curved portion that extends from an end of the main body, wherein the curved portion loops back and contacts the main body. Other embodiments may be described and/or claimed.