An electrical connector for electrically connecting a chip module, including an insulating body, multiple terminals fixed to the insulating body, a stiffener surrounding the periphery of the insulating body, a carrier for carrying the chip module onto the insulating body, and a load plate for pressing the chip module. The terminals are used for electrically connecting the chip module. The stiffener has a first pivoting portion and a second pivoting portion. The first pivoting portion is located in front of the second pivoting portion, and the first pivoting portion and the second pivoting portion are located on the same side of the insulating body. A rear end of the carrier is pivoted to the first pivoting portion, and a rear end of the load plate is pivoted to the second pivoting portion.

A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the first securing member into engagement with the second base member and moving the second securing member into engagement with the first base member.

An electrical connector for electrically connecting to a chip module. The chip module includes a base plate and a protruding portion projecting upward from the base plate. The electrical connector includes a socket for bearing the chip module, a fixing plate located above the base plate, and a load plate covering the chip module and the fixing plate. The load plate is provided with a first urging portion directly pressing the protruding portion downward, and a second urging portion pressing against the fixing plate downward, so that the fixing plate presses the base plate downward, thereby pressing the chip module downward and electrically connecting the chip module to the socket.

In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.

A motion body and a coupling method thereof are introduced. The motion body includes a first body and a coupling portion. The coupling portion is provided with a second body and an elastic element. The second body is disposed at the first body, and two ends of the elastic element respectively abut against the coupling portion and the second body to allow the coupling portion to enter a counterpart object and be located at a residing position or a pause position, enabling the motion body to be elastically assembled or elastically fastened with the counterpart object and to lift or fix an object by the first body. Thus, with coordination of the motion body, the counterpart object and the object, quick coupling of at least two objects can be completed to achieve effects of repeatedly quick coupling and separation.

An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.

Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.

An electrical connector for connecting a chip module, includes an insulating body, multiple conducting terminals received in the insulating body, and a fixing member having a base for fixing the chip module. The insulating body has an accommodating cavity that is rectangular and opened upward. A stop wall projects upward from each of four corners of the accommodating cavity. Each conducting terminal has a contact portion extending upward for electrically contacting a conductive connection surface of the chip module. The contact portions are located in the accommodating cavity and do not exceed the stop wall upward. The base is assembled above the insulating body. Four extending portions extend downward from the base and are assembled at an outer side of the stop walls. An inner side of each extending portion is provided with a guiding inclined surface cooperating with the outer side of the stop wall.

The present disclosure provides a reverse clamping compression device for CPO or NPO. The device includes a mechanical bolster placed on a main board, a compression cover covering optical modules, and a fastening connecting and fixing the compression cover to the mechanical bolster and protruding below the mechanical bolster. In the present disclosure, the compression cover above the optical modules is used to apply a compression force to the optical modules, and the spring element is placed in space below the main board, therefore, the space above the compression cover is not occupied, which can maximize the use of the space above the optical modules, greatly shorten the heat conduct path of the heat sink module, and ensure that the entire device is still assembled from top to bottom.

An electrical connector for electrically connecting to a chip module. The chip module includes a base plate and a protruding portion projecting upward from the base plate. The electrical connector includes a socket for bearing the chip module, a fixing plate located above the base plate, and a load plate covering the chip module and the fixing plate. The load plate is provided with a first urging portion directly pressing the protruding portion downward, and a second urging portion pressing against the fixing plate downward, so that the fixing plate presses the base plate downward, thereby pressing the chip module downward and electrically connecting the chip module to the socket.