Examples herein disclose an apparatus. The apparatus includes a first socket nested in a second socket. The first socket includes a cavity, disposed in the first socket, to accept a chipset. The first socket includes an electrical contact, disposed in the cavity, to couple the chipset to a board. The chipset detects when a modular infrastructure is coupled to the second socket.

There is described a modular connector receptacle comprising a shield and a modular connector assembly. The shield comprises an electrically-conductive material, and comprises a lumen defining an inner surface which comprises a thread. The modular connector assembly comprises peripheral winglets which engage with the thread of the inner surface of the lumen for screwably housing the modular connector assembly inside the shield. The peripheral winglets are electrically conductive, thus providing a ground. Low-pass filters are provided on a PCB in the modular connector assembly, and the PCB comprising the low-pass filters can have a PCB shield enclosing the PCB and electrically connected to the peripheral winglets for grounding to the shield.

A heat spreader includes a main body extending between a front and a rear configured to be mounted to a cage and heat transfer fingers cantilevered forward from the front of the main body. The heat transfer fingers each have a fixed end, a distal end, a top, a bottom and mating edges facing each other across gaps. The heat transfer fingers are configured to be received in corresponding channels between heat transfer fins of a pluggable module as the pluggable module is installed in the cage through the front end with the gaps receiving the heat transfer fins. The mating edges are configured to face and be thermally coupled to corresponding heat transfer fins. The heat transfer fingers transfer heat from the heat transfer fins rearward toward the distal ends and into the main body.

A heat spreader includes a main body extending between a front and a rear configured to be mounted to a cage and heat transfer fingers cantilevered forward from the front of the main body. The heat transfer fingers each have a fixed end, a distal end, a top, a bottom and mating edges facing each other across gaps. The heat transfer fingers are configured to be received in corresponding channels between heat transfer fins of a pluggable module as the pluggable module is installed in the cage through the front end with the gaps receiving the heat transfer fins. The mating edges are configured to face and be thermally coupled to corresponding heat transfer fins. The heat transfer fingers transfer heat from the heat transfer fins rearward toward the distal ends and into the main body.

Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator.

Examples herein disclose an apparatus. The apparatus includes a first socket nested in a second socket. The first socket includes a cavity, disposed in the first socket, to accept a chipset. The first socket includes an electrical contact, disposed in the cavity, to couple the chipset to a board. The chipset detects when a modular infrastructure is coupled to the second socket.

Embodiments herein relate to port frames and connectors for direct connections to integrated circuit packages. In various embodiments, a port frame to receive a connector and maintain a connection between the connector and a computer processor package may include a protrusion to provide stable attachment of the port frame to a bolster frame, a first wall, a second wall opposite the first wall, a first detent in the first wall, and a second detent in the second wall where the connector is to be received between the first wall and the second wall, and where the first detent is to receive a first locking protrusion extending from the connector and the second detent is to receive a second locking protrusion extending from the connector. Other embodiments may be described and/or claimed.

The present disclosure provides a reverse clamping compression device for CPO or NPO. The device includes a mechanical bolster placed on a main board, a compression cover covering optical modules, and a fastening connecting and fixing the compression cover to the mechanical bolster and protruding below the mechanical bolster. In the present disclosure, the compression cover above the optical modules is used to apply a compression force to the optical modules, and the spring element is placed in space below the main board, therefore, the space above the compression cover is not occupied, which can maximize the use of the space above the optical modules, greatly shorten the heat conduct path of the heat sink module, and ensure that the entire device is still assembled from top to bottom.