A structure includes a main substrate including a first surface and a second surface opposite to the first surface, a power supply module on the main substrate, a socket in the main substrate, and one or more power supply wirings and one or more signal wirings extending in a thickness direction of the main substrate and penetrating the socket. Each of the one or more power supply wirings includes a first end on the first surface side and a second end on a side opposite to the first end. Each of the one or more signal wirings includes a third end to be electrically connected to an electronic component and a fourth end on a side opposite to the third end. The fourth end is electrically connected to a conductor pattern on the first surface.

A carrier module assembly having a module removably attached to a carrier frame and a carrier riser. The carrier module assembly can be inserted into a slot of a control cabinet without having to re-wire or re-configure the control cabinet. The carrier module assembly has a length which enables the carrier module assembly to be located within the slot of the control cabinet. The module is removable from the carrier frame such that the module can be attached to a backplate of a rack.

A removable module, a system and a method. The removable module comprising a PCB having an OCP NIC form factor, an OCP edge connector comprising a plurality of pins on an edge of the PCB, wherein the OCP edge connector is configured to mate with an OCP board connector of a primary system board of the computing system in an installed state of the removable module in the computing system, a NIC chip mounted to the PCB and communicably connected to the OCP edge connector, at least one communication port mounted to the PCB and communicably connected to the NIC chip and a first PCIe slot mounted on the PCB and communicably connected to the OCP edge connector, wherein the NIC chip and the first PCIe slot are configured to be communicably connected to the primary system board via the OCP edge connector.

A removable module, a system and a method. The removable module comprising a PCB having an OCP NIC form factor, an OCP edge connector comprising a plurality of pins on an edge of the PCB, wherein the OCP edge connector is configured to mate with an OCP board connector of a primary system board of the computing system in an installed state of the removable module in the computing system, a NIC chip mounted to the PCB and communicably connected to the OCP edge connector, at least one communication port mounted to the PCB and communicably connected to the NIC chip and a first PCIe slot mounted on the PCB and communicably connected to the OCP edge connector, wherein the NIC chip and the first PCIe slot are configured to be communicably connected to the primary system board via the OCP edge connector.