Patent classifications
H05K7/1418
ASSEMBLING STRUCTURE FOR EXPANSION CARD
An assembling structure for an expansion card includes a frame and a supporting positioning element. The frame includes a body, a first assembling portion and a second assembling portion, wherein the body has a first side, a second side and a third side. The first assembling portion is disposed at the first side and the second assembling portion is disposed at the second side. The body is configured with a positioning portion close to the third side. The supporting positioning element is slidably connected to and pivoted to the positioning portion, wherein the supporting positioning element includes a first supporting positioning portion and a second supporting positioning portion. The supporting positioning element faces the second assembling portion via the first supporting positioning portion or the second supporting positioning portion.
Technologies for switching network traffic in a data center
Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.
1U rackmount enclosure and 1U rack
A 1 U connection chassis and a 1 U cabinet, wherein two or more intermediate plates (16) mutually parallel to one another are disposed inside the 1 U connection chassis; each of the intermediate plates (16) is provided with one or more slots mutually parallel to one another; two opposing slots on two adjacent intermediate plates (16) respectively constitute a mounting dock; an adaptor module (18) or a splice tray (19) is slidably inserted into each mounting dock; optical fiber adaptors are mounted inside the adaptor module (18). The chassis has optimized internal mounting space to allow more adaptor modules and/or splice trays to be mounted in the limited mounting space.
ELECTRONIC DEVICE STORAGE RACK AND RACK-MOUNTED TYPE ELECTRONIC DEVICE
An electronic device storage rack is equipped with a pair of first columns provided at intervals in a width direction; a pair of second columns provided at intervals in the width direction at positions away from the pair of first columns on a back side; a plurality of pairs of rails which connect the first column and the second column to support the electronic device main body to be slidable in a depth direction; a first fixing piece which is movable between an abutment position capable of abutting on the first column from the front side on the front side of the electronic device main body and a non-abutment position disposed between the first columns; and a second fixing piece which is movable between the abutment position capable of abutting on the second column from the back side on the back side of the electronic device main body and the non-abutment position disposed between the second columns.
Technologies for blind mating for sled-rack connections
Technologies for blind mating of optical connectors in a rack of a data center are disclosed. In the illustrative embodiment, a sled can be slid into a rack and an optical connector on the sled will blindly mate with a corresponding optical connector on the rack. The illustrative optical connector on the sled includes two guide post receivers which mate with corresponding guide posts on the optical connector on the rack such that, when mated, optical fibers of the optical connector on the rack will be aligned and optically coupled with corresponding optical fibers on the optical connector of the sled.
Technologies for switching network traffic in a data center
Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.
Technologies for switching network traffic in a data center
Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuitry is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.
Sealable multi-surface electronics thermal conduction package
An electronics thermal conduction package is provided. The package may include a housing and an interior space, or envelope, configured to receive a printed circuit board assembly (PCBA) with one or more microprocessors or other heat generating elements. The package can be elastically deformed to open a dimension of the envelope, or receiving cavity, such that a complete PCBA can be inserted inside the interior space of the package. Once inserted, the package may be returned to its undeformed, or substantially undeformed, state such that surfaces in the interior space of the package contact one or more of the heat generating elements on the PCBA creating a conductive thermal path from the heat generating elements to the housing of the package.
Technologies for dynamic remote resource allocation
Technologies for dynamically allocating resources among a set of managed nodes include an orchestrator server to receive telemetry data from the managed nodes indicative of resource utilization and workload performance by the managed nodes as the workloads are executed, generate a resource allocation map indicative of allocations of resources among the managed nodes, determine, as a function of the telemetry data and the resource allocation map, a dynamic adjustment to allocation of resources to at least one of the managed nodes to improve performance of at least one of the workloads executed on the at least one of the managed nodes, and apply the adjustment to the allocation of the resources among the managed nodes as the workloads are executed. Other embodiments are also described and claimed.
Accelerator resource allocation and pooling
Examples may include techniques to allocate physical accelerator resources from pools of accelerator resources. In particular, virtual computing devices can be composed from physical resources and physical accelerator resources dynamically allocated to the virtual computing devices. The present disclosure provides that physical accelerator resources can be dynamically allocated, or composed, to a virtual computing device despite not being physically coupled to other components in the virtual device.