A storage chassis may be adapted, or configured, to secure a plurality of carrierless devices (e.g., without the use of a carrier or drive tray) received thereby. The storage chassis may include a base, a first drive wall coupled to and extending from the base, and a second drive wall coupled to and extending from the base. The first drive wall may be spaced apart from the second drive wall. The base, the first drive wall, and the second drive wall may define a row of drive slots and each drive slot of the row of drive slots may be configured to receive a carrierless device. Further, the storage chassis may include a plate extending across the row of drive slots and may be configured to extend over the carrierless devices received by the row of drive slots.

Methods, systems, and devices for providing computer implemented services are disclosed. To provide the computer implemented services, the quantity of hardware resources available for providing the computer implemented services may be modified. The quantity of hardware resources may be modified by adding removable cards to a host system. The host system may, while the added removable cards are cold, selectively warm the removable cards through conduction heating to retain their temperatures within operating temperature ranges.

An electronic device (1), in particular a variable speed drive or alternator regulator, comprising a casing, the front of which has a housing for accommodating an ancillary module, a hatch (150) for closing said housing, and an electronic circuit comprising an interface card defining a housing for accommodating a memory card, opening into the housing for accommodating the ancillary module

A convertible chassis system for receiving a plurality of storage drives includes a chassis that includes a plurality of bays for receiving the storage drives. The convertible chassis also includes a reversible key that is removably affixed to the chassis body in either a first orientation or a second orientation. Each orientation provides a different key guide within the plurality of bays that either allows the storage drives to be received into or rejected from the bays of the chassis.

A riser assembly may include a riser cage and a riser card. The riser cage includes sidewalls, a base extending from the sidewalls, and mounting features to mount the riser cage to a chassis of the electronic device. The base is coupled to the riser card positioned on a first side of the base. The base includes an opening to permit the connector to extend through the opening to protrude partially beyond the opening to a location on a second side of the base where the connector can detachably connect to an expansion card installed in the riser cage between the sidewalls. The base contacts the connector around the opening to provide lateral support to the connector on opposing faces (e.g., first sidewalls) of the connector.

An electronic chassis includes a first side, and a second side opposite the first side. The electronic chassis also includes a first set of wedge lock support columns machined on the first side, and a second set of wedge lock support columns machined on the second side. Each wedge lock support column of the first set of wedge lock support columns and the second set of wedge lock support columns is machined as a continuous shape.

A method and apparatus provides high-accuracy measurements of an electrical parameter across a broad range of parameter input values. In one embodiment, an intelligent electronic device (IED), e.g., a digital electrical power and energy meter, with a plurality of independently-adjustable gain factors measures a parameter, and calculates and stores calibration factors associated with known values of the measured parameter. The IED or meter applies the stored calibration factors when measuring unknown values of the measured parameter, to improve the accuracy of the measurement.

A box-frame housing for the installation of electronic modules has frame elements and side walls and provides a subdivision into sub-regions, which are limited by dividing walls. The frame elements and the side walls and the dividing walls provide at least one recess and/or at least one edge projection. A projection engages in a recess and both are connected to one another by welding.

A system including a chassis and a hardware module bay disposed in a front portion of the chassis. The hardware module bay is configured to accommodate one or more horizontally oriented hardware modules. The one or more horizontally oriented hardware module are slidably insertable into the hardware module bay. The system further includes a main printed circuit board (PCB) that includes a chipset for communication with a hardware module inserted into the hardware module bay and a midplane disposed between the main PCB and the hardware module bay. The midplane is configured to electrically interface the hardware module inserted into the hardware module bay with the main PCB, upon insertion of the at least one horizontally oriented hardware module.

A data storage system is described that uses wafer-level packaging. In one embodiment an apparatus includes a silicon wafer, a plurality of memory cells formed directly on the wafer, an encapsulant formed over the memory cells, a plurality of wiring connections to connect the memory cells to an external interface, a memory controller, and an external interface.