An apparatus and a method of use are disclosed herein. The apparatus comprises a disaggregated fault tolerant backplane having a front side and a back side with at least two daughter card slots configured on the front side and configured to receive slot fanout signals over the backplane. The apparatus further comprises at least two switch boards (SBs) configured to provide electrical power to the at least two daughter card slots and at least one main fanout board (MFB) configured to send and receive SB control signals to and from the at least two SBs. The at least one MFB connects to the backplane through at least one MFB connector configured on the back side of the backplane. In one embodiment, the MFB receives control signals from the daughter card slots and sends slot fanout signals to the daughter card slots.

A modular controller includes an enclosure having an interior, a motherboard with a signal trace and a power trace supported within the interior of the enclosure, and one or more control section. The control section includes one or more of an input power section, an electromagnetic interference section, a logic section, a control section, a output power section, and a signal section that is supported by the motherboard to selectively flow of electrical power through the power trace using a control signal carried by the signal trace. Electrical systems and methods of making modular controllers are also described.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

A wall panel system including a first wall panel, the first panel including at least a first panel hook portion. The system also including a second wall panel having a different configuration than the first wall panel. The second panel includes at least a second panel hook portion and a third panel hook portion opposing the second panel hook portion. The first wall panel is configured to engage with the second wall panel to create a wall panel assembly.

A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

A rack adapted for receiving a component, a system including the rack and the component and a method of delivering power to the component mounted in the rack are disclosed. The rack comprises a backplane, a power panel, and a main controller. Each stage of the backplane includes a backplane power connector and a backplane data connector that are respectively connectable to a component power connector and to a component data connector when the component is inserted in the backplane stage. The main controller detects an insertion of the component in a given backplane stage by receiving a signal emitted by the backplane data connector of that backplane stage, acquires a set of power parameters of the component, and causes the power panel to provide power to the backplane power connector of that backplane stage according to the set of power parameters of the component.

A modular controller includes an enclosure having an interior, a motherboard with a signal trace and a power trace supported within the interior of the enclosure, and one or more control section. The control section includes one or more of an input power section, an electromagnetic interference section, a logic section, a control section, a output power section, and a signal section that is supported by the motherboard to selectively flow of electrical power through the power trace using a control signal carried by the signal trace. Electrical systems and methods of making modular controllers are also described.

An interposer and method of providing spatial and arrangement transformation are described. An electronic system has an electronic package, a motherboard and an interposer between the package and the motherboard. The interposer has signal and ground contacts on opposing surfaces that are respectively connected. The contacts opposing the package has a higher signal to ground contact ratio than the contacts opposing the motherboard, as well as different arrangements. Ground shielding vias in the interposer, which are connected to a ground plane, electrically isolate the signals through the interposer. The package may be mounted on a shielded socket such that signal and ground pins are mounted respectively in signal and ground socket mountings, ground shielding vias are between the signal socket mountings, and the ground socket mountings contain plated socket housings.

An electronic unit comprising a box defining a reception compartment for receiving an electronic module along two mutually opposite directions of an insertion axis, the compartment including electrical power supply means for powering the electronic module and connection means for connecting the electronic unit to the electronic module, these means extending onto a connection face forming part of the reception compartment and extending parallel to the insertion axis. An electronic module for mounting in a compartment of an electronic unit of the invention.