Patent classifications
H05K7/1488
Coolant Distribution Unit and Control System
Embodiments of the invention provide a high density liquid cooling system including a rack, primary loop piping including a primary inlet, a primary outlet, a primary loop filter, and a primary bypass valve, and secondary loop piping including a secondary inlet, a secondary outlet, a first pump, a first filter downstream of the first pump, and a secondary bypass valve. The system includes a heat exchanger having a first side and a second side. When the primary bypass valve is open, at least a portion of the fluid in the primary loop piping flows through the primary inlet and the primary outlet without traversing the heat exchanger, and when the secondary bypass valve is open, at least a portion of the fluid in the secondary loop piping flows through the secondary inlet and the secondary outlet without traversing the heat exchanger.
MODULAR NETWORK SWITCHES, ASSOCIATED STRUCTURES, AND ASSOCIATED METHODS OF MANUFACTURE AND USE
Modular network switches and other computer systems are described herein. A modular network switch can include a latching device for installing and removing computer modules (e.g., line cards) from an associated cabinet or enclosure. The network switch can also include interconnected computer modules (e.g., line cards, fabric cards, control modules, etc.) that include circuit boards oriented parallel to the flow of cooling air through the cabinet in the absence of a backplane or midplane oriented perpendicular to the air flow. The absence of such backplanes and/or midplanes provides a more direct air flow path through the cabinet, thereby enabling a more efficient flow of cooling air and lower operating temperatures. Additionally, the network switch can include an orthogonal arrangement of data planes, control planes, and/or power planes that can be efficiently interconnected to increase operational speed and further facilitate the flow of cooling air through the computer cabinet.
Faux column intermediate distribution frame enclosure
A vertical column assembly including an intermediate distribution frame enclosure with an internal structure. The vertical column assembly also includes side panels, door assemblies, and a top cover assembly. The internal structure is hidden by the side panels, the door assemblies, and the top cover assembly. The vertical column assembly encases the network equipment installed within the internal structure.
Features for cable managers and other electronic equipment structures
A cable manager includes a backbone assembly and at least one side wall extending from the backbone assembly. The at least one side wall optionally includes one or more cable finger units. The backbone assembly includes a spine member having an extruded construction. The spine member includes one or more channels extending substantially an entire length thereof to facilitate easy attachment, removal and/or repositioning of a structure relative to the spine member. The cable manager optionally includes an accessory rod, a half-spool assembly, a cable finger accessory, a strap/buckle accessory, and/or a door assembly having an interference-free hinge set.
RACK HOUSINGS HAVING AN ADJUSTABLE AIR VOLUME
A rack housing includes, for example, a frame, a door attachable to a front of said frame, a plurality of movable supports for supporting a plurality of electronic devices in the frame, and an actuator for moving said plurality of movable supports to define an adjustable air volume in the rack housing for receiving cooling air from a raised floor of a data center. Methods can include, for example, moving a plurality of frame supported electronic devices in a data center, wherein the moving is controlled in dependence on received data. Computer-implemented methods, computer program products, and systems are also disclosed.
MODULAR THERMAL ISOLATION BARRIER FOR DATA PROCESSING EQUIPMENT STRUCTURE
A data processing equipment structure includes a plurality of vertical and horizontal frame components, which, together, define an equipment structure frame, and a plurality of panels disposed relative to the equipment structure frame to define a periphery. At least one of the plurality of vertical and horizontal frame components is an extruded strut having a generally uniform cross-section. The extruded strut includes an outwardly-facing channel extending along each of a pair of opposing sides of the extruded strut, at least one of which includes a set of evenly-spaced ridges, extending along each of two sides of the channel, for accommodating a threaded fastener. The extruded strut further includes one or more ledges, each having a depth sufficient to accommodate a thickness of one of the plurality of panels.
Physical layer management (PLM) system for use with an optical distribution frame having trays with selectable patch side
One embodiment is directed to a tray for use in a subrack of a rack. The tray comprises a printed circuit board configured so that a plurality of connections can be made at a plurality of positions on the printed circuit board, each of the plurality of connections involving at least one connector positioned on a patch side of the plurality of positions and the least one connector having a device associated therewith in which information is stored. The tray is configured so that either side of the positions can be used as the patch side. The tray is configured so that the devices associated with the connectors involved in making the connections at the patch side can be read via the tray. The devices associated with the connections can be implemented, for example, using RFID tags or connection point identifier (CPID) storage devices (such as EEPROMs).
Expansion card frame and server chassis
An expansion card frame is configured to be mount on a casing of a server chassis and is configured for installations of a riser card and an expansion card. The expansion card frame includes a side plate and a top plate. The side plate is configured for the installation of the riser card. The riser card is configured for an insertion of the expansion card. The top plate is connected to a side of the side plate and configured to cover the riser card. The top plate has at least one assembling structure, and the at least one assembling structure of the top plate is configured to be assembled with at least one assembling structure of an assembling frame so that the top plate, the side plate, and the assembling frame together form an accommodation space for accommodating a disk drive.
METHODS AND SYSTEM FOR OIL IMMERSION COOLING
A system for immersion cooling computing system equipment includes a container, a volume of cooling liquid disposed in the container, a computing system equipment holder disposed in the volume of cooling liquid and a liquid-liquid heat exchanger attached to and supported by the computing system equipment holder. The liquid-liquid heat exchanger is disposed in the volume of cooling liquid.
High-Speed Performance Electrical Connector for Modular Electronics Systems
A connector gap between a module connector mating surface and the backplane connector of a chassis may be eliminated through a mechanism that forcefully pushes (or pulls) the module towards the backplane and/or forcefully pushes (or pulls) the backplane toward the module. A spring-loaded or resilient element may be used to fasten the module in a way that effectively fills any designed-in and tolerance-induced gap in the connector interface, allowing the connector to fully seat. In addition, a gasket or other compressible member may be included at the connector mating interface. The gap in the connector interface may be reduced by introducing adjustable card cage members that are capable of being set during the assembly or manufacturing process using special alignment fixtures. The gap in the connector interface may also be reduced by introducing a higher tolerance capable manufacturing process, such as machining, to the card cage sub-assembly.