A double-floor member includes at least one first guide rail (24) that is fixed to an upper surface and at least one first connecting member (27) that is movable in the longitudinal direction of the first guide rail (24) and is engaged with the first guide rail (24) so as not to be separated upward from the first guide rail (24).

A data center micro-module includes: an enclosure, and a cabinet system, a power supply system, and a cooling system that are inside the enclosure. The cabinet system installs a computing server, the power supply system supplies power for the computing server and the cooling system, and the cooling system cools the computing server; and the enclosure is further externally provided with an interface configured to connect to another data center micro-module or connection apparatus. The foregoing data center micro-module integrates the power supply system, the cooling system and the computing server into a same module, and therefore can be directly manufactured in a factory. When a data center is built, the data center micro-modules only need to be combined and assembled, which greatly reduces a construction cycle of the data center, and the hardware architecture may be flexibly changed according to a specific deployment requirement.

A plurality of air data may be collected by a sensor within a data center. The plurality of air data is received by a processor. At least a portion of the received plurality of air data corresponding to at least one zone within the data center may be determined to satisfy a threshold. Coordinates of a geographical location associated with the zone that includes the sensor may be transmitted to a robotic filter. The robotic filter can be dispatched to the transmitted geographic location to filter the zone.

The present disclosure relates to a mobile data center unit, which is adapted to house at least one rack being designed to provide storage space for electronic equipment. The mobile data center unit is equipped with passive cooling means in order to provide dissipation of heat being generated by the electronic equipment.

Disclosed are row cooling units and connecting units with a network of integrated fluid distribution piping that may be interconnected to construct a liquid cooling system to carry way heat generated by servers housed within the server racks used in data centers. The assembly of row cooling units and connecting units may be connected to the supply and return loops of the data center facility to distribute cooling liquid to the electronic components of the servers and to return heated liquid for heat removal. The network of fluid distribution piping integrated into the row cooling units and connecting units enables the configuration of the liquid cooling system to be independent of the fixed infrastructure of the facility, affording ease of scalability, serviceability, maintenance, while increasing efficiency, resiliency, availability and reliability of the liquid cooling system critical to the operation and performance of the data center.

Cooling systems of one or more electronic racks in a cluster or point of deliver (PoD) are disclosed. A data center system includes an array of electronic racks. Each electronic rack contains a number of server chassis. The system further includes a number of rear cooling doors respectively connected to the electronic racks. Each rear cooling door cools warm/hot air exhaust from a corresponding electronic rack. The system further includes a number of airflow distributors. Each airflow distributor attaches to a side of an electronic rack to supply and distribute a cool/cold airflow to the electronic rack. The distributor either assembled in the PoD or pre-attached with the racks. The system further includes a containment to direct the cooled air towards the airflow distributors.

A portable, EMI-shielded data center and server rack system, includes a carrying case sized to allow the carrying case to be carried onboard an aircraft. A server tray rack rail apparatus is disposed within the carrying case to accommodate one or more server trays that are slidable along the rack rail apparatus. An EMI gasket is disposed within each of the EMI channels on the front-side and back-side of the carrying case. A front-side lid and a back-side lid are removably attached to the carrying case via a latching mechanism, such that when the front-side lid and back-side lid are latched to the carrying case, and the EMI gasket is disposed with the EMI front-side and back-side channels, the carrying case is sealed from EMI occurrences.

A mobile datacenter cooling system is disclosed. The mobile datacenter cooling system includes at least one container that in turn includes a container manifold to circulate coolant associated with a cooling tower to one or more liquid-cooled racks within the at least one container and to enable fluid coupling of the container manifold with a second container manifold of a second container.

Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

A local cooler includes: a housing formed into a box shape; a heat exchanger provided along a slope extending upward to a rear portion from a lower position located on the front side of the housing; a first intake/exhaust port provided on a front surface of the housing; a second intake/exhaust port provided on a bottom surface of the housing; third intake/exhaust ports provided at a plurality of locations among side surfaces, upper surface and rear surface of the housing; and a closing plate capable of selectively shielding these intake/exhaust ports.