Devices, systems, and methods for managing server chassis are disclosed. The server chassis may be managed thermally by controlling a flow of gas through an opening in the server chassis. The server chassis may be managed for security by controlling physical access to various portions of the server chassis, and, for example, to a portion of the server chassis proximate to an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed electromagnetically by controlling a flow of electromagnetic radiation into and out of the server chassis and, for example, through an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed structurally by physically reinforcing various portions of the server chassis.

A power distribution cabinet is disclosed which includes multiple internal compartments for separating and channeling hot air generated by high heat generating components out of the cabinet without coming into contact with more heat sensitive components. The cabinet includes a baffle structure which forms an internal wall within the cabinet, which helps to form a high heat compartment and an upper compartment. The high heat compartment houses a heat generating component. Cool air is allowed to flow into a lower area of the cabinet and into the high heat compartment, and is also channeled into the upper compartment where at least one other heat generating component is located. The baffle structure channels hot air formed within the high heat compartment out toward a rear area of the equipment cabinet, while also helping to channel warm air created within the upper compartment through a top panel of the cabinet.

A solar powered cooler for a smart device such as a smartphone or smart tablet is provided, optionally with a device holder and a solar powered charger unit. The cooler may include an upper fan casing, an optional bottom fan casing, smart device holder, and an air passage formed between the upper fan casing and the smart device holder. The heat dissipation structure of the smart device holder for holding a smart device is disposed in the close proximity space of the smart device to provide a good heat dissipation effect by way of active cooling (forced convection) and passive cooling (natural convection) so as to enhance the heat dissipation performance of the smart device.

A control system for mounting to a vertically-extending rail. The control system includes a plurality of bases, each having a channel formed therein that is adapted for mounting to the rail. A plurality of modules are provided for removable mounting to the bases, respectively. Each module has circuitry for processing control signals and a housing enclosing the circuitry. At least a bottom end of each housing has openings therein to permit air to flow into the housing and over the circuitry. A plurality of air flow deflectors are provided for mounting to the bases, respectively. When the modules and the air flow deflectors are mounted to the bases, the air flow deflectors form pockets with the bottom ends of the modules. The pockets have enlarged openings disposed parallel to sides of the modules.

A ventilation and air conditioning system (6) is for a room (2) containing a heat source and the ventilation and air conditioning system (6) comprising a cooled air supply (12) and a ventilation duct (10). The ventilation duct (10) includes a primary inlet (24) connected to the cooled air supply (12) and an outlet (14) leading into the room (2). A number of heat storage elements (30) is arranged inside the ventilation duct (10) between the primary inlet (24) and the outlet (14), such that during operation of the cooled air supply (12) there is a forced stream of cooled air through the ventilation duct (10), thereby cooling and preferably freezing the heat storage elements (30). A secondary inlet (36) into the ventilation duct (10) is in flow communication with the room (2) and during operation of the cooled air supply (12) is closed by a damper (40). The damper (40) is designed to automatically open in a passive manner when the forced stream of cooled air from the cooled air supply (12) stops, such that a natural convection airflow through the ventilation duct (10) is supported, and the natural convection airflow is cooled by transferring heat to the heat storage elements (30).

A passive vortex formed or induced from a temperature difference across a cavity or void aggregates and supports a horizontal flow over the top of the cavity. A cavity of a suitable depth and width exhibits a small difference in temperature, or heat source, along the sides or bottom of cavity. A resulting convective flow tends to form a rising current along a warmer side, and a complementary downward current on an opposed side of the cavity. The formed vortex tends to draw the cooler downward flow across the warmer, heated surface, enhancing the vortex flow. The vortex aligns with a horizontal flow across the top of the cavity as the upward current complements the downward current on an opposed side of the cavity. A plurality of adjacent cavities tend to align with an aggregate horizontal flow contributed from each cavity.

An information handling system includes a computing component that is sensitive to corrosion; and a chassis in which the computing component is disposed. The chassis receives an airflow used to thermally manage the computing component, and expels the airflow after thermally managing the computing component. The information handling system also includes an environmental control component that reduces a condensation formation propensity of a portion of the airflow that traverses the chassis proximate to the computing component.

Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.

A line card includes a metal frame that includes a front section, and a bottom section connected to the front section via an angled section, where the angled section results in an opening between the line card and a second line card, when the line card is installed above the second line card in a rack, and where the opening allows directed air to enter the rack from a front direction; a printed circuit board attached to the metal frame; and a group of front panel connectors attached to the front section of the metal frame.

An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.