Disclosed is a heat dissipation module assembly comprising: a base disposed adjacent to a heating unit and a heat dissipation module including one or more heat dissipation fins, the heat dissipation fin having an inlet portion and an outlet portion formed on both sides thereof and a hollow flow channel communicating with the inlet portion and the outlet portion, wherein the one or more heat dissipation fins being stacked to emit heat through the outlet portion, the heat being generated from the heating unit and absorbed by air flowed in through the inlet portion.

It is impossible to avoid the increase in device cost and maintenance cost in order to cool a plurality of heat sources efficiently using a natural-circulation type phase-change cooling device; therefore, a phase-change cooling device according to an exemplary aspect of the present invention includes a plurality of heat receiving units configured to hold respectively refrigerant receiving heat from a plurality of heat sources; a condensing unit configured to generate refrigerant liquid by condensing and liquefying refrigerant vapor of the refrigerant evaporated in the heat receiving units; a refrigerant vapor transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant vapor; and a refrigerant liquid transport structure connecting the heat receiving units to the condensing unit and configured to transport the refrigerant liquid, wherein the refrigerant liquid transport structure includes a main-liquid-pipe connected to the condensing unit, a refrigerant liquid reservoir connected to the main-liquid-pipe and configured to store the refrigerant liquid, and a plurality of sub-liquid-pipes respectively connecting the refrigerant liquid reservoir to the plurality of heat receiving units.

An electronic component heat dissipation apparatus and methods having a heat dissipation housing. The heat dissipation housing having an external wall and an internal wall defining outer chamber therebetween. The internal wall defines an internal chamber having an airflow inlet opening and an airflow outlet opening. The housing is aligned with at least one electronic component so as to define a thermal chimney through the internal chamber for the flow of heated air. The external wall has at least one external air opening configured to allow external air into the outer chamber. The internal wall has a plurality of heat dissipation nozzles. Each heat dissipation nozzle has an external air inlet opening located within the internal wall and an external air outlet opening located within the internal chamber. The diameter of the external air inlet opening is greater than the diameter of the external air outlet opening. This allows external air to be pushed and/or pulled through the plurality of heat dissipation nozzles from the outer chamber into the internal chamber at an increasing velocity. The external air is then mixed with the flow of heated air thereby increasing the speed of the flow of heated air though the internal chamber.

An electronic device includes a cover for one or more heat generating components, with the cover providing at least a combined conductive, convective, and radiant cooling for the heat generating components while maintaining the device within a prescribed temperature range. Conductive cooling is realized by providing thermal coupling between each of two or more depression regions in the cover and one or more heat generating components. Appropriate placement of air inlets and outlets through the cover provides convective cooling of the heat generating components and the thermally coupled depression regions. Heat from the heat generating components thermally coupled to one depression region is effectively isolated from heat generated by other heat generating components thermally coupled to another adjacent depression region at least in part via the air outlets through an interior region between the two adjacent depression regions. Radiant cooling can also be improved by increasing the emissivity of the device cover material.

A circuit board of an electronic control device has a surface to which a connector is attached and on which a heat generating component is mounted. A metal casing that stores therein the circuit board has an opposing surface that faces the surface of the circuit board on which the heat generating component is mounted. A first fin that protrudes toward the surface on which the heat generating component is mounted is provided on the opposing surface of the casing. The first fin overlaps the heat generating component in the thickness direction of the circuit board.

An exemplary heat dissipation apparatus includes a bracket, a reticular cover fixed to the bracket and a receiving space being defined with the bracket, and a tray received in the receiving space. The tray includes a first surface and a second surface. A number of first through holes is defined on the bracket. A number of second through holes is defined on the tray respectively corresponding to the first through holes, each of the second through holes extends obliquely from the first surface of the tray to the second surface of the tray relative to a vertical line of the first and second surfaces of the tray. A first magnet is installed on the first surface of the tray, a second magnet corresponding to the first magnet is installed on the bracket.

An airflow control system includes a chassis defining a chassis housing that includes at least one airflow inlet and an airflow outlet. A cooled device is located in the chassis housing between the at least one airflow inlet and the airflow outlet. A convection enhancing heat element is located in the chassis housing between the cooled device and the airflow outlet. A controller is coupled to the convection enhancing heat element and configured to activate the convection enhancing heat element such that a convective airflow through the chassis housing is increased.

A circuit breaker according to the present invention includes a terminal switching unit mounted in an enclosure thereof, and the terminal switching unit accommodates, in a base as an outer casing thereof, a fixed contactor and a movable contactor contactable with and separated from each other, a sliding unit rotatably supporting the movable contactor, and a detection mechanism to detect a fault current. Radiators are provided at side portions of at least one of a contact portion where the movable contactor comes in contact with the fixed contactor, the sliding unit and the detection mechanism, each radiator radiating heat to the outside of the base. This may prevent an increase in temperature of the circuit breaker within a limited space without an increase in costs.

The present invention is an electronic device unit including an electronic device that has air inlets formed on a bottom surface of a main housing body having electronic components housed therein, and that introduces air to an inner part of the main housing body through the air inlets to cool the inner part of the main housing body, and a battery pack that is attached to the main housing body in a state where a battery case covers a part of a portion being an extensional region of the air inlets, wherein a surrounding wall part is provided on the bottom surface of the main housing body to surround a ventilation region in which the air inlets are provided and to be open at a portion facing the ventilation region, and the battery case is attached to the main housing body via protruding ends of the surrounding wall part.

One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.